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MCP1754S bảng dữ liệu(PDF) 5 Page - Microchip Technology |
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5 / 44 page 2011-2013 Microchip Technology Inc. DS22276B-page 5 MCP1754/MCP1754S 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Input Voltage, VIN..................................................................+17.6V VIN, PWRGD, SHDN ..................... (GND-0.3V) to (VIN+0.3V) VOUT .................................................. (GND-0.3V) to (+5.5V) Internal Power Dissipation ............ Internally-Limited (Note 6) Output Short Circuit Current ................................. Continuous Storage temperature .....................................-55°C to +150°C Maximum Junction Temperature.....................165°C (Note 7) Operating Junction Temperature...................-40°C to +150°C ESD protection on all pins kV HBM and 200V MM † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. AC/DC CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VR + 1V, Note 1, ILOAD = 1 mA, COUT = 1µF (X7R), CIN = 1 µF (X7R), TA = 25°C, tr(VIN) = 0.5V/µs, SHDN = VIN, PWRGD = 10K to VOUT. Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Input / Output Characteristics Input Operating Voltage VIN 3.6 — 16.0 V Output Voltage Operating Range VOUT-RANGE 1.8 — 5.5 V Input Quiescent Current Iq —56 90 µA IL = 0 mA Input Quiescent Current for SHDN mode ISHDN —0.1 5 µA SHDN = GND Ground Current IGND — 150 250 µA ILOAD = 150 mA Maximum Output Current IOUT 150 —— mA Output Soft Current Limit IOUT_SCL — 250 — mA VIN = VIN(MIN), VOUT 0.1V, Current measured 10 ms after load is applied Output Pulse Current Limit IOUT_PCL — 250 — mA Pulse Duration < 100 ms, Duty Cycle < 50%, VOUT 0.1V, Note 6 Output Short Circuit Foldback Current IOUT_SC —30 — mA VIN = VIN(MIN), VOUT = GND Output Voltage Overshoot on Startup VOVER —0.5 — %VOUT VIN = 0 to 16V, ILOAD = 150 mA Output Voltage Regulation VOUT VR-2.0% VR±0.2% VR+2.0% V Note 2 VOUT Temperature Coefficient TCVOUT — 22 ppm/°C Note 3 Note 1: The minimum VIN must meet two conditions: VIN3.6V and VIN VR + VDROPOUT(MAX). 2: VR is the nominal regulator output voltage when the input voltage VIN = VRated + VDROPOUT(MAX) or ViIN = 3.6V (which- ever is greater); IOUT = 1 mA. 3: TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * Temperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range. 4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCVOUT. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below the output volt- age value that was measured with an applied input voltage of VIN = VR + 1V or VIN = 3.6V (whichever is greater). 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device operating junction temperature to exceed the maximum 150°C rating. Sustained junc- tion temperatures above 150°C can impact the device reliability. 7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature over the ambient temperature is not significant. |
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