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FDC642 bảng dữ liệu(PDF) 1 Page - Fairchild Semiconductor

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FDC642 bảng dữ liệu(HTML) 1 Page - Fairchild Semiconductor

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FDC642P, Rev. B
FDC642P
P-Channel 2.5V Specified PowerTrenchTM MOSFET
July 1999
1999 Fairchild Semiconductor Corporation
Absolute Maximum Ratings T
A
= 25°C unless otherwise noted
Symbol
Parameter
Ratings
Units
VDSS
Drain-Source Voltage
-20
V
VGSS
Gate-Source Voltage
±8
V
ID
Drain Current
- Continuous
(Note 1)
-4
A
Drain Current
- Pulsed
(Note 1a)
-20
PD
Power Dissipation for Single Operation
(Note 1a)
1.6
W
(Note 1b)
0.8
TJ, Tstg
Operating and Storage Junction Temperature Range
-55 to +150
°C
Thermal Characteristics
R
θJA
Thermal Resistance, Junction-to-Ambient
(Note 1a)
78
°C/W
R
θJC
Thermal Resistance, Junction-to-Case
(Note 1)
30
°C/W
Package Outlines and Ordering Information
Device Marking
Device
Reel Size
Tape Width
Quantity
.642
FDC642P
7’’
8mm
3000 units
Features
• -4 A, -20 V. R
DS(ON) = 0.065 Ω @ VGS = -4.5 V
R
DS(ON) = 0.100 Ω @ VGS = -2.5 V
• Fast switching speed.
• Low gate charge (7.2nC typical).
• High performance trench technology for extremely
low R
DS(ON).
• SuperSOTTM-6 package: small footprint (72% smaller
than standard SO-8); low profile (1mm thick).
3
5
6
4
1
2
3
D
D
D
S
D
G
SuperSOT -6
TM
General Description
This P-Channel 2.5V specified MOSFET is produced
using Fairchild's advanced PowerTrench process that
has been especially tailored to minimize on-state
resistance and yet maintain low gate charge for
superior switching performance.
These devices have been designed to offer exceptional
power dissipation in a very small footprint for
applications where the larger packages are impractical.
Applications
• Load switch
• Battery protection
• Power management


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