© 2002 Fairchild Semiconductor Corporation

DS500580

www.fairchildsemi.com

March 2002

Revised March 2002

74LCXZ16245

Low Voltage 16-Bit Bidirectional Transceiver

with 5V Tolerant Inputs and Outputs

General Description

The LCXZ16245 contains sixteen non-inverting bidirec-

tional buffers with 3-STATE outputs and is intended for bus

oriented applications. The device is designed for low volt-

facing to a 5V signal environment. The device is byte

controlled. Each byte has separate control inputs which

could be shorted together for full 16-bit operation. The T/R

inputs determine the direction of data flow through the

device. The OE inputs disable both the A and B ports by

placing them in a high impedance state.

the high impedance state during power-up or power-down.

This places the outputs in the high impedance (Z) state

preventing intermittent low impedance loading or glitching

in bus oriented applications.

The LCXZ16245 is fabricated with an advanced CMOS

technology to achieve high speed operation while maintain-

ing CMOS low power dissipation.

Features

s 5V tolerant inputs and outputs

s Power-down high impedance inputs and outputs

s Supports live insertion/withdrawal (Note 1)

s

±24 mA output drive (V

s Implements patented noise/EMI reduction circuitry

s Latch-up performance conforms to the requirements of

JESD78

s ESD performance:

Human body model

> 2000V

Machine model

> 200V

s Also packaged in plastic Fine-Pitch Ball Grid Array

(FBGA) (Preliminary)

Note 1: To ensure the high-impedance state during power up or down, OE

resistor is determined by the current-sourcing capability of the driver.

Ordering Code:

Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.

Note 2: BGA package available in Tape and Reel only.

Logic Symbol

Order Number

Package Number

Package Description

74LCXZ16245GX

(Note 2)

BGA54A

(Preliminary)

54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide

[TAPE and REEL]

74LCXZ16245MTD

MTD48

48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide