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74LCXH16373MEA bảng dữ liệu(PDF) 1 Page - Fairchild Semiconductor |
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1 / 11 page © 2001 Fairchild Semiconductor Corporation DS500440 www.fairchildsemi.com February 2001 Revised August 2001 74LCXH16373 Low Voltage 16-Bit Transparent Latch with Bushold General Description The LCXH16373 contains sixteen non-inverting latches with 3-STATE outputs and is intended for bus oriented applications. The device is byte controlled. The flip-flops appear transparent to the data when the Latch Enable (LE) is HIGH. When LE is LOW, the data that meets the setup time is latched. Data appears on the bus when the Output Enable (OE) is LOW. When OE is HIGH, the outputs are in a high impedance state. The LCXH16373 is designed for low voltage (2.5V or 3.3V) VCC applications with capability of interfacing to a 5V signal environment. The LCXH16373 is fabricated with an advanced CMOS technology to achieve high speed operation while maintain- ing CMOS low power dissipation. The LCXH16373 data inputs include active bushold cir- cuitry, eliminating the need for external pull-up resistors to hold unused or floating data input at a valid logic level. Features I 5V tolerant control inputs and outputs I 2.3V–3.6V VCC specifications provided I 5.4 ns tPD max (VCC = 3.3V), 20 µA ICC max I Bushold on inputs eliminates the need for external pull-up/pull-down resistors I Power down high impedance outputs I ±24 mA output drive (VCC = 3.0V) I Implements patented noise/EMI reduction circuitry I Latch-up performance exceeds 500 mA I ESD performance: Human body model > 2000V Machine model > 200V I Also available in plastic Fine-Pitch Ball Grid Array (FBGA) (Preliminary) Ordering Code: Note 1: BGA package available in Tape and Reel only. Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Logic Symbol Order Number Package Number Package Description 74LCXH16373GX (Note 1) BGA54A (Preliminary) 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide [TAPE and REEL] 74LCXH16373MEA (Note 2) MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide 74LCXH16373MTD (Note 2) MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide |
Số phần tương tự - 74LCXH16373MEA |
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Mô tả tương tự - 74LCXH16373MEA |
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