STTH1002C-Y

Characteristics

Doc ID 17536 Rev 2

5/9

Figure 11.

Thermal resistance junction to ambient versus copper surface under tab (Epoxy

printed circuit board FR4, copper thickness = 35 µm) for DPAK

Figure 7.

(typical values, per diode)

Figure 8.

Peak reverse recovery current

(typical values, per diode)

t (ns)

rr

0

10

20

30

40

50

60

70

80

10

100

1000

dI /dt(A/µs)

F

I =5A

F

V =160V

R

T =25°C

j

T =125°C

j

I

(A)

RM

0

1

2

3

4

5

6

7

8

9

10

11

12

13

10

100

1000

dI /dt(A/µs)

F

I =5A

F

V =160V

R

T =25°C

j

T =125°C

j

Figure 9.

Dynamic parameters versus

junction temperature

Figure 10.

Thermal resistance junction to

ambient versus copper surface

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

25

50

75

100

125

150

T (°C)

j

Q;

[T ]/Q ;I

[T =125°C]

RM

j

rr RM

j

I =5A

F

V =160V

R

0

10

20

30

40

50

60

70

80

02468

10

12

14

16

18

20

S(Cu)(cm²)

R

(°C/W)

th(j-a)

Epoxy printed circuit board FR4, copper thickness = 35 µm

0

10

20

30

40

50

60

70

80

90

100

0

2

4

6

8

10

12

14

16

18

20

R

(°C/W)

th(j-a)

S(Cu)(cm²)