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ADS42B49 bảng dữ liệu(PDF) 3 Page - Texas Instruments |
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ADS42B49 bảng dữ liệu(HTML) 3 Page - Texas Instruments |
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3 / 66 page  ADS42B49 www.ti.com SBAS558B – DECEMBER 2012 – REVISED JANUARY 2013 ABSOLUTE MAXIMUM RATINGS (1) VALUE MIN MAX UNIT AVDD –0.3 2.1 V Supply voltage range AVDD_BUF –0.3 3.6 V DRVDD –0.3 2.1 V AGND and DRGND –0.3 0.3 V AVDD to DRVDD –2.4 2.4 V (when AVDD leads DRVDD) Voltage between: DRVDD to AVDD –2.4 2.4 V (when DRVDD leads AVDD) AVDD_BUF to DRVDD and AVDD –3.9 3.9 V Minimum INP, INM –0.3 V (3, AVDD_BUF + 0.3) Voltage applied to CLKP, CLKM(2) –0.3 AVDD + 0.3 V RESET, SCLK, SDATA, SEN, –0.3 3.9 V CTRL1, CTRL2, CTRL3 Operating free-air, TA –40 +85 °C Temperature range Operating junction, TJ +125 °C Storage, Tstg –65 +150 °C Electrostatic discharge (ESD) rating Human body model (HBM) 2 kV (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) When AVDD is turned off, TI recommends switching off the input clock (or ensuring the voltage on CLKP, CLKM is less than |0.3 V|). This configuration prevents the ESD protection diodes at the clock input pins from turning on. THERMAL INFORMATION ADS42B49 THERMAL METRIC(1) RGC UNIT 64 PINS θJA Junction-to-ambient thermal resistance 23.9 θJCtop Junction-to-case (top) thermal resistance 10.9 θJB Junction-to-board thermal resistance 4.3 °C/W ψJT Junction-to-top characterization parameter 0.1 ψJB Junction-to-board characterization parameter 4.4 θJCbot Junction-to-case (bottom) thermal resistance 0.6 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: ADS42B49 |
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