NXP Semiconductors

BUK7Y8R7-60E

N-channel 60 V, 8.7 mΩ standard level MOSFET in LFPAK56

BUK7Y8R7-60E

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Product data sheet

20 February 2013

9 / 12

11. Package outline

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT669

MO-235

06-03-16

11-03-25

0

2.5

5 mm

scale

e

E1

b

c2

A2

A2

b

c

A

e

UNIT

DIMENSIONS (mm are the original dimensions)

mm

1.10

0.95

A3

A1

0.15

0.00

1.20

1.01

0.50

0.35

b2

4.41

3.62

b3

2.2

2.0

b4

0.9

0.7

0.25

0.19

c2

0.30

0.24

4.10

3.80

6.2

5.8

H

1.3

0.8

L2

0.85

0.40

L

1.3

0.8

L1

8°

0°

w

y

5.0

4.8

3.3

3.1

max

0.25

4.20

1.27

0.25 0.1

1

2

3

4

mounting

base

D1

c

Plastic single-ended surface-mounted package (LFPAK; Power-SO8); 4 leads

SOT669

E

b2

b3

b4

H

D

L2

L1

A

A

C

C

X

1/2

e

y C

θ

θ

(A )

3

L

A

A1

detail X

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

Fig. 16. Package outline LFPAK; Power-SO8 (SOT669)