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ADP3333ARM-33 bảng dữ liệu(PDF) 7 Page - Analog Devices |
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ADP3333ARM-33 bảng dữ liệu(HTML) 7 Page - Analog Devices |
7 / 8 page REV. 0 ADP3333 –7– Calculating Junction Temperature Device power dissipation is calculated as follows: PV V I V I D IN OUT LOAD IN GND =− () + () Where ILOAD and IGND are load current and ground current, VIN and VOUT are the input and output voltages respectively. Assuming the worst-case operating conditions are ILOAD = 300 mA, IGND = 2.6 mA, VIN = 4.0 V and VOUT = 3.0 V, the device power dissipation is: P V V mA V mA mW D =− () + () = 40 30 300 42 20 308 .. . . The package used on the ADP3333 has a thermal resistance of 158 °C/W for 4-layer boards. The junction temperature rise above ambient will be approximately equal to: TW C W C A J =× ° = ° 0 308 158 48 7 ./ . So, to limit the junction temperature to 125 °C, the maximum allowable ambient temperature is: TC C C MAX A() .. =° − ° = ° 125 48 7 76 3 Shutdown Mode Applying a high signal to the shutdown pin, or connecting it to the input pin, will turn the output ON. Pulling the shutdown pin to 0.3 V or below, or connecting it to ground, will turn the output OFF. In shutdown mode, the quiescent current is reduced to less than 1 µA. Printed Circuit Board Layout Considerations Use the following general guidelines when designing printed circuit boards: 1. Keep the output capacitor as close to the output and ground pins as possible. 2. Keep the input capacitor as close to the input and ground pins as possible. 3. PC board traces with larger cross sectional areas will remove more heat from the ADP3333. For optimum heat transfer, specify thick copper and use wide traces. 4. Connect the NC pins (Pins 5, 6, and 8) to ground for better thermal performance. 5. The thermal resistance can be decreased by approximately 10% by adding a few square centimeters of copper area to the lands connected to the pins of the LDO. 6. Use additional copper layers or planes to reduce the thermal resistance. Again, connecting the other layers to the ground and NC pins of the ADP3333 is best, but not necessary. When connecting the ground pad to other layers use multiple vias. |
Số phần tương tự - ADP3333ARM-33 |
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Mô tả tương tự - ADP3333ARM-33 |
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