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ADP3333ARM-33 bảng dữ liệu(PDF) 7 Page - Analog Devices

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ADP3333ARM-33 bảng dữ liệu(HTML) 7 Page - Analog Devices

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REV. 0
ADP3333
–7–
Calculating Junction Temperature
Device power dissipation is calculated as follows:
PV
V
I
V
I
D
IN
OUT
LOAD
IN
GND
=−
()
+
()
Where ILOAD and IGND are load current and ground current, VIN
and VOUT are the input and output voltages respectively.
Assuming the worst-case operating conditions are ILOAD =
300 mA, IGND = 2.6 mA, VIN = 4.0 V and VOUT = 3.0 V, the
device power dissipation is:
P
V
V
mA
V
mA
mW
D =−
()
+
()
=
40
30
300
42
20
308
..
.
.
The package used on the ADP3333 has a thermal resistance of
158
°C/W for 4-layer boards. The junction temperature rise
above ambient will be approximately equal to:
TW
C W
C
A
J
°
=
°
0 308
158
48 7
./
.
So, to limit the junction temperature to 125
°C, the maximum
allowable ambient temperature is:
TC
C
C
MAX
A()
..
=° −
° =
°
125
48 7
76 3
Shutdown Mode
Applying a high signal to the shutdown pin, or connecting it to
the input pin, will turn the output ON. Pulling the shutdown
pin to 0.3 V or below, or connecting it to ground, will turn the
output OFF. In shutdown mode, the quiescent current is reduced
to less than 1
µA.
Printed Circuit Board Layout Considerations
Use the following general guidelines when designing printed
circuit boards:
1. Keep the output capacitor as close to the output and ground
pins as possible.
2. Keep the input capacitor as close to the input and ground
pins as possible.
3. PC board traces with larger cross sectional areas will remove
more heat from the ADP3333. For optimum heat transfer,
specify thick copper and use wide traces.
4. Connect the NC pins (Pins 5, 6, and 8) to ground for better
thermal performance.
5. The thermal resistance can be decreased by approximately
10% by adding a few square centimeters of copper area to
the lands connected to the pins of the LDO.
6. Use additional copper layers or planes to reduce the thermal
resistance. Again, connecting the other layers to the ground and
NC pins of the ADP3333 is best, but not necessary. When
connecting the ground pad to other layers use multiple vias.


Số phần tương tự - ADP3333ARM-33

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
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Mô tả tương tự - ADP3333ARM-33

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