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ADG711BRU bảng dữ liệu(PDF) 4 Page - Analog Devices |
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4 / 8 page ADG711/ADG712/ADG713 –4– REV. 0 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG711/ADG712/ADG713 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE ABSOLUTE MAXIMUM RATINGS 1 (TA = +25°C unless otherwise noted) VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +6 V Analog, Digital Inputs 2 . . . . . . . . . . . –0.3 V to VDD +0.3 V or 30 mA, Whichever Occurs First Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA (Pulsed at 1 ms, 10% Duty Cycle max) Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C TSSOP Package, Power Dissipation . . . . . . . . . . . . . 430 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 150 °C/W θ JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 27°C/W ORDERING GUIDE Model Temperature Range Package Description Package Option ADG711BR –40 °C to +85°C 0.15" Small Outline (SOIC) R-16A ADG712BR –40 °C to +85°C 0.15" Small Outline (SOIC) R-16A ADG713BR –40 °C to +85°C 0.15" Small Outline (SOIC) R-16A ADG711BRU –40 °C to +85°C Thin Shrink Small Outline (TSSOP) RU-16 ADG712BRU –40 °C to +85°C Thin Shrink Small Outline (TSSOP) RU-16 ADG713BRU –40 °C to +85°C Thin Shrink Small Outline (TSSOP) RU-16 SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 520 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 125 °C/W θ JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 42 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. PIN CONFIGURATION (TSSOP/SOIC) TOP VIEW (Not to Scale) 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 NC = NO CONNECT IN1 D1 S1 NC GND S4 D4 IN4 IN2 D2 S2 VDD NC S3 D3 IN3 ADG711 ADG712 ADG713 Table I. Truth Table (ADG711/ADG712) ADG711 In ADG712 In Switch Condition 01 ON 1 0 OFF Table II. Truth Table (ADG713) Logic Switch 1, 4 Switch 2, 3 0 OFF ON 1 ON OFF |
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