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ADG709 bảng dữ liệu(PDF) 5 Page - Analog Devices

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Giải thích chi tiết về linh kiện  CMOS, 3 ohm Low Voltage 4-/8-Channel Multiplexers
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ADG709 bảng dữ liệu(HTML) 5 Page - Analog Devices

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ADG708/ADG709
–5–
REV. 0
ABSOLUTE MAXIMUM RATINGS
1
(TA = 25
°C unless otherwise noted)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –3.5 V
Analog Inputs
2 . . . . . . . . . . . . . . V
SS – 0.3 V to VDD +0.3 V or
30 mA, Whichever Occurs First
Digital Inputs
2 . . . . . . . . . . . . . . . . . . –0.3 V to V
DD +0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
. . . . . . . . . . . . . . . . . (Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Industrial (B, C Versions) . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADG708/ADG709 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 432 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . .
150.4
°C/W
θ
JC Thermal Impedance . . . . . . . . . . . . . . . . . . . .
27.6
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
Table I. ADG708 Truth Table
A2
A1
A0
EN
Switch Condition
XXX0
NONE
00011
00112
01013
01114
10015
10116
11017
11118
X = Don’t Care
Table II. ADG709 Truth Table
A1
A0
EN
ON Switch Pair
X
X
0
NONE
00
1
1
01
1
2
10
1
3
11
1
4
X = Don’t Care.
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
ADG708BRU
–40
°C to +85°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
ADG709BRU
–40
°C to +85°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
ADG708CRU
–40
°C to +85°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
ADG709CRU
–40
°C to +85°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
PIN CONFIGURATIONS
TSSOP
A0
EN
S2
S3
S4
VSS
S1
D
1
2
16
15
5
6
7
12
11
10
3
4
14
13
8
9
TOP VIEW
(Not to Scale)
ADG708
A1
A2
S5
S6
S7
GND
VDD
S8
A0
EN
S2A
S3A
S4A
VSS
S1A
DA
1
2
16
15
5
6
7
12
11
10
3
4
14
13
8
9
TOP VIEW
(Not to Scale)
ADG709
A1
GND
S2B
S3B
S4B
VDD
S1B
DB


Số phần tương tự - ADG709

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