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AD7834BR bảng dữ liệu(PDF) 4 Page - Analog Devices

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REV. A
–4–
AD7834/AD7835
ABSOLUTE MAXIMUM RATINGS
1
(TA = +25°C unless otherwise noted)
VCC to DGND . . . . . . . . . . . . . . . –0.3 V, +7 V or VDD + 0.3 V
(Whichever Is Lower)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +17 V
VSS to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –17 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +0.3 V
Digital Inputs to DGND . . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V
VREF(+) to VREF(–) . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +18 V
VREF(+) to AGND . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
VREF(–) to AGND . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
DSG to AGND . . . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
VOUT (1–4) to AGND . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . . . . –40
°C to +85°C
Extended (S Version). . . . . . . . . . . . . . . . . –55
°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Plastic Package
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . +75
°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260
°C
Cerdip Package
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . +52
°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300
°C
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7834/AD7835 feature proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ORDERING GUIDE
Linearity
Temperature
Error
DNL
Package
Model
Range
(LSBs)
(LSBs)
Option
1
AD7834AR
–40
°C to +85°C
±2
±0.9
R-28
AD7834BR
–40
°C to +85°C
±1
±0.9
R-28
AD7834AN
–40
°C to +85°C
±2
±0.9
N-28
AD7834BN
–40
°C to +85°C
±1
±0.9
N-28
AD7834SQ
–55
°C to +125°C
±2
±0.9
Q-28
AD7835AS
2
–40
°C to +85°C
±2
±0.9
S-44
AD7835BS
2
–40
°C to +85°C
±1
±0.9
S-44
AD7835AP2
–40
°C to +85°C
±2
±0.9
P-44A
NOTES
1R = Small Outline IC (SOIC); N = Plastic DIP; Q = Cerdip; S = Plastic Quad Flatpack (PQFP);
P = Plastic Leaded Chip Carrier (PLCC).
2Contact Sales Office for availability.
SOIC Package
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . +75
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
PQFP Package
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . . 95
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
PLCC Package
θ
JA Thermal Impedance. . . . . . . . . . . . . . . . . . . . . . +55°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
Power Dissipation (Any Package) . . . . . . . . . . . . . . . . 480 mW
NOTES
1Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2Transient currents of up to 100 mA will not cause SCR latch up.


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