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AD7834BR bảng dữ liệu(PDF) 4 Page - Analog Devices |
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AD7834BR bảng dữ liệu(HTML) 4 Page - Analog Devices |
4 / 16 page REV. A –4– AD7834/AD7835 ABSOLUTE MAXIMUM RATINGS 1 (TA = +25°C unless otherwise noted) VCC to DGND . . . . . . . . . . . . . . . –0.3 V, +7 V or VDD + 0.3 V (Whichever Is Lower) VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +17 V VSS to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –17 V AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +0.3 V Digital Inputs to DGND . . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V VREF(+) to VREF(–) . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +18 V VREF(+) to AGND . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V VREF(–) to AGND . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V DSG to AGND . . . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V VOUT (1–4) to AGND . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V Operating Temperature Range Industrial (A Version) . . . . . . . . . . . . . . . . . –40 °C to +85°C Extended (S Version). . . . . . . . . . . . . . . . . –55 °C to +125°C Storage Temperature Range . . . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C Plastic Package θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . +75 °C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260 °C Cerdip Package θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . +52 °C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300 °C WARNING! ESD SENSITIVE DEVICE CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7834/AD7835 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ORDERING GUIDE Linearity Temperature Error DNL Package Model Range (LSBs) (LSBs) Option 1 AD7834AR –40 °C to +85°C ±2 ±0.9 R-28 AD7834BR –40 °C to +85°C ±1 ±0.9 R-28 AD7834AN –40 °C to +85°C ±2 ±0.9 N-28 AD7834BN –40 °C to +85°C ±1 ±0.9 N-28 AD7834SQ –55 °C to +125°C ±2 ±0.9 Q-28 AD7835AS 2 –40 °C to +85°C ±2 ±0.9 S-44 AD7835BS 2 –40 °C to +85°C ±1 ±0.9 S-44 AD7835AP2 –40 °C to +85°C ±2 ±0.9 P-44A NOTES 1R = Small Outline IC (SOIC); N = Plastic DIP; Q = Cerdip; S = Plastic Quad Flatpack (PQFP); P = Plastic Leaded Chip Carrier (PLCC). 2Contact Sales Office for availability. SOIC Package θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . +75 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C PQFP Package θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 95 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C PLCC Package θ JA Thermal Impedance. . . . . . . . . . . . . . . . . . . . . . +55°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C Power Dissipation (Any Package) . . . . . . . . . . . . . . . . 480 mW NOTES 1Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Transient currents of up to 100 mA will not cause SCR latch up. |
Số phần tương tự - AD7834BR |
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Mô tả tương tự - AD7834BR |
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