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AD630KN bảng dữ liệu(PDF) 2 Page - Analog Devices

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Giải thích chi tiết về linh kiện  Balanced Modulator/Demodulator
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AD630KN bảng dữ liệu(HTML) 2 Page - Analog Devices

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AD630–SPECIFICATIONS
REV. C
–2–
ORDERING GUIDE
Temperature
Package
Package
Model
Ranges
Descriptions
Options
AD630JN
0
°C to +70°C
Plastic DIP
N-20
AD630KN
0
°C to +70°C
Plastic DIP
N-20
AD630AD
–25
°C to +85°C Side Brazed DIP D-20
AD630BD
–25
°C to +85°C Side Brazed DIP D-20
AD630SD
–55
°C to +125°C Side Brazed DIP D-20
AD630SD/883B
–55
°C to +125°C Side Brazed DIP D-20
5962-8980701RA –55
°C to +125°C Side Brazed DIP D-20
AD630SE/883B
–55
°C to +125°C LCC
E-20A
5962-89807012A –55
°C to +125°C LCC
E-20A
AD630JCHIPS
0
°C to +70°C
Chip
AD630SCHIPS
–55
°C to +125°C Chip
(@ + 25 C and
VS =
15 V unless otherwise noted)
Model
AD630J/A
AD630K/B
AD630S
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
GAIN
Open Loop Gain
90
110
100
120
90
110
dB
±1, ±2 Closed Loop Gain Error
0.1
0.05
0.1
%
Closed Loop Gain Match
0.1
0.05
0.1
%
Closed Loop Gain Drift
2
2
2
ppm/
°C
CHANNEL INPUTS
VIN Operational Limit
1
(–VS + 4 V) to (+VS – 1 V)
(–VS + 4 V) to (+VS – 1 V)
(–VS + 4 V) to (+VS – 1 V)
Volts
Input Offset Voltage
500
100
500
µV
Input Offset Voltage
TMIN to TMAX
800
160
1000
µV
Input Bias Current
100
300
100
300
100
300
nA
Input Offset Current
10
50
10
50
10
50
nA
Channel Separation @ 10 kHz
100
100
100
dB
COMPARATOR
VIN Operational Limit
1
(–VS + 3 V) to (+VS – 1.5 V)
(–VS + 3 V) to (+VS – 1.5 V)
(–VS + 3 V) to (+VS – 1.3 V)
Volts
Switching Window
1.5
1.5
1.5
mV
Switching Window
TMIN to TMAX
2
2.0
2.0
2.5
mV
Input Bias Current
100
300
100
300
100
300
nA
Response Time (–5 mV to +5 mV Step)
200
200
200
ns
Channel Status
ISINK @ VOL = –VS + 0.4 V
3
1.6
1.6
1.6
mA
Pull-Up Voltage
(–VS + 33 V)
(–VS + 33 V)
(–VS + 33 V)
Volts
DYNAMIC PERFORMANCE
Unity Gain Bandwidth
2
2
2
MHz
Slew Rate4
45
45
45
V/
µs
Settling Time to 0.1% (20 V Step)
3
3
3
µs
OPERATING CHARACTERISTICS
Common-Mode Rejection
85
105
90
110
90
110
dB
Power Supply Rejection
90
110
90
110
90
110
dB
Supply Voltage Range
5
±16.5
5
±16.5
5
±16.5
Volts
Supply Current
4
5
4
5
4
5
mA
OUTPUT VOLTAGE, @ RL = 2 k
TMIN to TMAX
2
10
10
±10
Volts
Output Short Circuit Current
25
25
25
mA
TEMPERATURE RANGES
Rated Performance–N Package
0
+70
0
+70
N/A
°C
Rated Performance–D Package
–25
+85
–25
+85
–55
+125
°C
NOTES
1If one terminal of each differential channel or comparator input is kept within these limits the other terminal may be taken to the positive supply.
2These parameters are guaranteed but not tested for J and K grades. For A, B and S grades they are tested.
3I
SINK @ VOL = (–VS + 1) volt is typically 4 mA.
4Pin 12 Open. Slew rate with Pins 12 and 13 shorted is typically 35 V/
µs.
Specifications subject to change without notice.
Specifications shown in boldface are tested on all production units at final electrical test. Results from those tests are used to calculate outgoing quality levels. All min
and max specifications are guaranteed, although only those shown in boldface are tested on all production units.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±18 V
Internal Power Dissipation . . . . . . . . . . . . . . . . . . . . . 600 mW
Output Short Circuit to Ground . . . . . . . . . . . . . . . . Indefinite
Storage Temperature, Ceramic Package . . . . –65
°C to +150°C
Storage Temperature, Plastic Package . . . . . . –55
°C to +125°C
Lead Temperature Range (Soldering, 10 sec ) . . . . . . . +300
°C
Max Junction Temperature . . . . . . . . . . . . . . . . . . . . . +150
°C
THERMAL CHARACTERISTICS
θ
JC
θ
JA
20-Pin Plastic DIP (N)
24
°C/W
61
°C/W
20-Pin Ceramic DIP (D)
35
°C/W
120
°C/W
20-Pin Leadless Chip Carrier (E)
35
°C/W
120
°C/W


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