AD53033

–5–

REV. 0

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD53033 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

1

Power Supply Voltage

PWR GND to ECL GND or HQ GND . . . . . . . . . .

±0.4 V

Inputs

DATA, DATA, IOD, IOD, RLD, RLD . . . . . . +5 V, –3 V

DATA to DATA, IOD to IOD, RLD to RLD . . . . . . .

±3 V

LEL, LEL, LEH, LEH . . . . . . . . . . . . . . . . . . . +5 V, –3 V

LEL to LEL, LEH to LEH . . . . . . . . . . . . . . . . . . . . .

±3 V

VH, VL, VTERM to GND . . . . . . . . . . . . . . . . +9 V, –4 V

VH to VL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±11 V

(VH – VTERM) and (VTERM – VL) . . . . . . . . . . . .

±11 V

HCOMP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +9 V, –4 V

LCOMP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +9 V, –4 V

Outputs

2

Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA

Surge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100 mA

THERM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +13 V, 0 V

Environmental

Operating Temperature (Junction) . . . . . . . . . . . . . . +175

°C

Storage Temperature . . . . . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature (Soldering, 10 sec)

3

. . . . . . . . . . +260

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

sections of this specification is not implied. Absolute maximum limits apply

individually, not in combination. Exposure to absolute maximum rating condi-

tions for extended periods may affect device reliability.

sinking is employed to ensure compliance with the operating temperature limits.

± 0.002 inches) and solderability, handling with bare

hands should be avoided and the device should be stored in environments at 24

°C

± 5°C (75°F ± 10°F) with relative humidity not to exceed 65%.

Table III. Package Thermal Characteristics

Air Flow, FM

033

200

25

400

22

ORDERING GUIDE

Shipment Method

Package

Quantity per

Package

Model

Description

Shipping Container

Option

AD53033JSTP

52-Lead LQFP-EDQUAD

90

SQ-52