TC1401N

REV5_20070502

Phone: 886-6-5050086

Fax: 886-6-5051602

5 / 5

Cgs

Cgd

Cds

Rg

Rd

Rdb

Ris

Rs

Id

Lg

Ld

Ls

Cbs

Rid

SCHEMATI

Cgs

Cgd

Cds

Rg

Rd

Rds

Ri

Rs

Gm

T

Lg

Ld

Ls

PARAMETERS

Lg

0.071 nH

Rs

1.68 Ohm

Rg

1.27 Ohm

Ls

0.013 nH

Cgs

2.36 pF

Cds

0.297 pF

Ri

2.01 Ohm

Rds

103.7 Ohm

Cgd

0.069 pF

Rd

1.75 Ohm

Gm

253 mS

Ld

0.013 nH

T

3.9 psec

SCHEMATI

TOM2 MODEL PARAMETERS

VTO

-1.812 V

VMAX

0.5 V

ALPHA

14.13

CGD

0.0691 pF

BETA

0.354

CGS

3.9867 pF

GAMMA

0.0228

CDS

0.278 pF

DELTA

0.1565

RIS

2.005 Ohm

Q

0.88

RID

0.0001 Ohm

NG

0.1

VBR

15 V

ND

0.01

RDB

119.667 Ohm

TAU

3.9 ps

CBS

4.7433 pF

RG

1.2733 Ohm TNOM

25

°C

RD

1.32 Ohm LS

0.0131 nH

RS

1.675 Ohm LG

0.0715 nH

IS

1E-11 mA

LD

0.013 nH

N

1

AFAC

1

VBI

1 V

NFING

1

VDELTA

0.2 V

CHIP HANDLING

DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be

accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290

°C ± 5°C; Handling Tool: Tweezers;

Time: less than 1min.

WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil

(0.018 to 0.025 mm) gold wire. Stage temperature: 220

°C to 250°C; Bond Tip Temperature: 150°C; Bond Force:

20 to 30 gms depending on size of wire and Bond Tip Temperature.

HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised

during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at all

stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.