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VNH5050A-E bảng dữ liệu(PDF) 4 Page - STMicroelectronics |
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VNH5050A-E bảng dữ liệu(HTML) 4 Page - STMicroelectronics |
4 / 33 page List of figures VNH5050A-E 4/33 Doc ID 16009 Rev 10 List of figures Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 4. Definition of the delay times measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 5. Definition of the low-side switching times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 6. Definition of the high-side switching times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 7. Definition of dynamic cross conduction current during a PWM operation. . . . . . . . . . . . . . 16 Figure 8. Definition of delay response time of sense current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 9. Waveforms in full-bridge operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 10. Waveforms in full-bridge operation (continued) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 11. Typical application circuit for DC to 20 kHz PWM operation short circuit protection . . . . . 21 Figure 12. Behavior in fault condition (how a fault can be cleared) . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 13. Half-bridge configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 14. Multi-motors configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 15. PowerSSO-36™ PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 16. Chipset configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 17. Auto and mutual Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . 25 Figure 18. Detailed chipset configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Figure 19. PowerSSO-36 HSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . 27 Figure 20. PowerSSO-36 LSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . 27 Figure 21. Thermal fitting model of an H-bridge in PowerSSO-36. . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Figure 22. PowerSSO-36 TP package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Figure 23. PowerSSO-36 TP tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Figure 24. PowerSSO-36 TP tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 |
Số phần tương tự - VNH5050A-E |
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Mô tả tương tự - VNH5050A-E |
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