STPS3H100

Characteristics

Doc ID 16776 Rev 1

5/9

Figure 13.

Thermal resistance junction to ambient versus copper surface under each lead

(SMBflat)

Figure 11.

Forward voltage drop versus

forward current

Figure 12.

Thermal resistance junction to

ambient versus copper surface

under each lead (SMB)

I

(A)

FM

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

T

(Maximum values)

T

(Maximum values)

T

(Maximum values)

T

(Typical values)

T

(Typical values)

V

(V)

FM

R

(°C/W)

th(j-a)

0

10

20

30

40

50

60

70

80

90

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMB

S

(cm²)

CU

R

(°C/W)

th(j-a)

0

10

20

30

40

50

60

70

80

90

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMB flat

S

(cm²)

CU