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5 / 52 page © 2005-2012 Microchip Technology Inc. DS22018F-page 5 MCP2021/2/1P/2P 1.0 DEVICE OVERVIEW The MCP2021/2/1P/2P provides a physical interface between a microcontroller and a LIN half-duplex bus. It is intended for automotive and industrial applications with serial bus speeds up to 20 Kbaud. The MCP2021/2/1P/2P provides a half-duplex, bidirec- tional communications interface between a microcon- troller and the serial network bus. This device will translate the CMOS/TTL logic levels to LIN-level logic, and vice versa. The LIN specification 2.0 requires that the trans- ceiver(s) of all nodes in the system be connected via the LIN pin, referenced to ground, and with a maximum external termination resistance load of 510 Ω from LIN bus to battery supply. The 510 Ω corresponds to 1 Mas- ter and 16 Slave nodes. The MCP2021/2/1P/2P-500 provides a +5V, 50 mA, regulated power output. The regulator uses an LDO design, is short-circuit protected, and will turn the regulator output off if it falls below 3.5V. The MCP2021/2/1P/2P also includes thermal- shutdown protection. The regulator is specifically designed to operate in the automotive environment and will survive +43V load dump transients, double-battery jumps, and reverse battery connections when a reverse blocking diode is used. The other members of the MCP2021/2/1P/2P- 330 family output +3.3V at 50 mA with a turn-off voltage of 2.5V. (See Section 1.6 “Internal Voltage Regulator”). MCP2021/2 wakes from Power-Down mode on a dominant level on LBUS. MCP2021P/2P wakes at a transition from recessive level to dominant level on LBUS. 1.1 Optional External Protection 1.1.1 REVERSE BATTERY PROTECTION An external reverse-battery-blocking diode should be used to provide polarity protection (see Figure 1-6). 1.1.2 TRANSIENT VOLTAGE PROTECTION (LOAD DUMP) An external 43V transient suppressor (TVS) diode, between VBB and ground, with a 50 Ω transient protec- tion resistor (RTP) in series with the battery supply and the VBB pin protect the device from power transients (see Figure 1-6) and ESD events. While this protection is optional, it is considered good engineering practice. The resistor value is chosen according to Equation 1-1. EQUATION 1-1: 1.2 Internal Protection 1.2.1 ESD PROTECTION For component-level ESD ratings, please refer to the Section 2.1 “Absolute Maximum Ratings†”. 1.2.2 GROUND LOSS PROTECTION The LIN Bus specification states that the LIN pin must transition to the recessive state when ground is discon- nected. Therefore, a loss of ground effectively forces the LIN line to a hi-impedance level. 1.2.3 THERMAL PROTECTION The thermal protection circuit monitors the die temper- ature and is able to shut down the LIN transmitter and voltage regulator if it detects a thermal overload. There are three causes for a thermal overload. A ther- mal shut down can be triggered by any one, or a com- bination of, the following thermal overload conditions: • Voltage regulator overload • LIN bus output overload • Increase in die temperature due to increase in environmental temperature Driving the TXD and checking the RXD pin makes it possible to determine whether there is a bus contention (i.e., Rx = low, Tx = high) or a thermal overload condi- tion (i.e., Rx = high, Tx = low). RTP <= (VBBmin - 5.5) / 250 mA. 5.5V = VUVLO + 1.0V, 250 mA is the peak current at Power-On when VBB = 5.5V |
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