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SN74ABT245B-EP bảng dữ liệu(PDF) 1 Page - Texas Instruments |
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SN74ABT245B-EP bảng dữ liệu(HTML) 1 Page - Texas Instruments |
1 / 10 page SN74ABT245BEP OCTAL BUS TRANSCEIVER WITH 3STATE OUTPUTS SCBS798 - FEBRUARY 2004 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Controlled Baseline − One Assembly/Test Site, One Fabrication Site D Extended Temperature Performance of −55 °C to 125°C D Enhanced Diminishing Manufacturing Sources (DMS) Support D Enhanced Product-Change Notification D Qualification Pedigree† D Typical VOLP (Output Ground Bounce) <1 V at VCC = 5 V, TA = 25°C D Ioff and Power-Up 3-State Support Hot Insertion † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. D High-Drive Outputs (−24-mA IOH, 32-mA IOL) D Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD 17 D ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) description/ordering information This octal bus transceiver is designed for asynchronous communication between data buses. The device transmits data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are effectively isolated. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. ORDERING INFORMATION TA PACKAGE‡ ORDERABLE PART NUMBER TOP-SIDE MARKING −55 °C to 125°C SSOP − DB Tape and reel SN74ABT245BMDBREP ABT245MEP ‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Copyright 2004, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. DB PACKAGE (TOP VIEW) 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 DIR A1 A2 A3 A4 A5 A6 A7 A8 GND VCC OE B1 B2 B3 B4 B5 B6 B7 B8 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. |
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