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ISL26708IRTZ bảng dữ liệu(PDF) 5 Page - Intersil Corporation |
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5 / 21 page ISL26712, ISL26710, ISL26708 5 FN7999.3 September 5, 2012 Absolute Maximum Ratings Thermal Information Any Pin to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.0V Analog Input to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD + 0.3V Digital I/O to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD + 0.3V Digital Input Voltage to GND . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD + 0.3V Maximum Current In to Any Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA ESD Rating Human Body Model (Tested per JESD22-A114F) . . . . . . . . . . . . . . . . 8kV Machine Model (Tested per JESD22-A115B) . . . . . . . . . . . . . . . . . 400V Charged Device Model (Tested per JESD22-C101E) TDFN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0kV SOT-23 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5kV Latch Up (Tested per JESD78C; Class 2, Level A) . . . . . . . . . . . . . . . 100mA Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 8 Ld TDFN Package (Notes 6, 8) . . . . . . . . . 41 6 8 Ld SOT-23 Package (Notes 7, 9). . . . . . . . 135 99 Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 6. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 7. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 8. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. 9. For θJC, the “case temp” location is taken at the package top center. Electrical Specifications VDD = +3.0V to +3.6V, FSCLK = 18MHz, FS = 1MSPS, VREF = 2.0V; VDD = +4.75V to +5.25V, FSCLK = 18MHz, FS =1MSPS, VREF = 2.5V; VCM = VREF, unless otherwise noted. Typical values are at TA = +25°C. Boldface limits apply over the operating temperature range, -40°C to +85°C. SYMBOL PARAMETER TEST CONDITIONS ISL26712 ISL26710 ISL26708 UNITS MIN (Note 10) TYP MAX (Note 10) MIN (Note 10) TYP MAX (Note 10) MIN (Note 10) TYP MAX (Note 10) DYNAMIC PERFORMANCE SINAD Signal-to (Noise + Distortion) Ratio FIN = 100kHz VDD = +4.75V to +5.25V 70.0 71.4 61.0 61.6 49.0 49.8 dB FIN = 100kHz VDD = +3.0V to +3.6V 68.5 70.5 60.7 61.5 49.0 49.8 dB THD Total Harmonic Distortion FIN = 100kHz VDD = +4.75V to +5.25V -84 -76 -82 -74 -75 -60 dB FIN = 100kHz VDD = +3.0V to +3.6V -84 -74 -82 -72 -73 -60 dB SFDR Spurious Free Dynamic Range FIN = 100kHz VDD = +4.75V to +5.25V -87 -76 -82 -76 -68 -60 dB FIN = 100kHz VDD = +3.0V to +3.6V -85 -74 -82 -74 -68 -60 dB IMD Intermodulation Distortion 2nd and 3rd order, FIN = 90kHz, 110kHz -89 -83 -81 dB tpd Aperture Delay 1 1 1 ns Δtpd Aperture Jitter 15 15 15 ps β3dB Full Power Bandwidth @ –3dB 15 15 15 MHz DC ACCURACY NResolution 12 10 8 Bits INL Integral Nonlinearity -1 ±0.4 1-0.5 ±0.1 0.5 -0.2 ±0.03 0.2 LSB DNL Differential Nonlinearity Guaranteed no missing codes -0.95 ±0.3 0.95 -0.5 ±0.1 0.5 -0.2 ±0.03 0.2 LSB OFFSET Zero-Code Error Zero Volt Differential Input -6 ±0.2 6-2.5 ±0.2 2.5 -1.25 ±0.03 1.25 LSB |
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