Data Sheet

ADMP441

Rev. A | Page 11 of 16

APPLICATIONS INFORMATION

POWER SUPPLY DECOUPLING

For best performance and to avoid potential parasitic artifacts,

placing a 0.1 μF ceramic type X7R or better capacitor between

capacitor should be placed as close to Pin 7 as possible.

The connections to each side of the capacitor should be as short

as possible, and the trace should stay on a single layer with no

vias. For maximum effectiveness, locate the capacitor equidistant

from the power and ground pins or, when equidistant placement

is not possible, slightly closer to the power pin. Thermal connec-

tions to the ground planes should be made on the far side of the

capacitor, as shown in Figure 14.

TO GND

CAPACITOR

Figure 14. Recommended Power Supply Bypass Capacitor Layout

HANDLING INSTRUCTIONS

Pick-and-Place Equipment

The MEMS microphone can be handled using standard pick-

and-place and chip shooting equipment. Care should be taken

to avoid damage to the MEMS microphone structure as follows:

•

Use a standard pickup tool to handle the microphone.

Because the microphone hole is on the bottom of the

package, the pickup tool can make contact with any part

of the lid surface.

•

Use care during pick-and-place to ensure that no high

shock events above 10,000 g are experienced because such

events may cause damage to the microphone.

•

Do not pick up the microphone with a vacuum tool that

makes contact with the bottom side of the microphone.

Do not pull air out of or blow air into the microphone port.

•

Do not use excessive force to place the microphone on

the PCB.

Reflow Solder

For best results, the soldering profile should be in accordance

with the recommendations of the manufacturer of the solder

paste used to attach the MEMS microphone to the PCB. It is

recommended that the solder reflow profile does not exceed the

limit conditions specified in Figure 4 and Table 5.

Board Wash

When washing the PCB, ensure that water does not make

contact with the microphone port. Blow-off procedures and

ultrasonic cleaning must not be used.

SUPPORTING DOCUMENTATION

Evaluation Board User Guide

MEMS Microphone Evaluation Board

Circuit Note

CN-0208, High Performance Digital MEMS Microphone's Simple

Application Notes

AN-1112 Application Note, Microphone Specifications and

Terms Explained

AN-1003 Application Note, Recommendations for Mounting and

Connecting Analog Devices, Inc., Bottom-Ported MEMS

Microphones

AN-1068 Application Note, Reflow Soldering of the MEMS

Microphone

AN-1124 Application Note, Recommendations for Sealing

Analog Devices, Inc., Bottom-Port MEMS Microphones from

Dust and Liquid Ingress

For additional information, visit www.analog.com/mic.