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AD5735 bảng dữ liệu(PDF) 11 Page - Analog Devices

tên linh kiện AD5735
Giải thích chi tiết về linh kiện  Quad-Channel, 12-Bit, Serial Input, 4 mA to 20 mA
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Data Sheet
AD5735
Rev. B | Page 11 of 48
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
100 mA do not cause SCR latch-up.
Table 4.
Parameter
Rating
AVDD, VBOOST_x to AGND, DGND
−0.3 V to +33 V
AVSS to AGND, DGND
+0.3 V to −28 V
AVDD to AVSS
−0.3 V to +60 V
AVCC to AGND
−0.3 V to +7 V
DVDD to DGND
−0.3 V to +7 V
Digital Inputs to DGND
−0.3 V to DVDD + 0.3 V or +7 V
(whichever is less)
Digital Outputs to DGND
−0.3 V to DVDD + 0.3 V or +7 V
(whichever is less)
REFIN, REFOUT to AGND
−0.3 V to AVDD + 0.3 V or +7 V
(whichever is less)
VOUT_x to AGND
AVSS to VBOOST_x or 33 V if using
the dc-to-dc converter
+VSENSE_x, −VSENSE_x to AGND
AVSS to VBOOST_x or 33 V if using
the dc-to-dc converter
IOUT_x to AGND
AVSS to VBOOST_x or 33 V if using
the dc-to-dc converter
SWx to AGND
−0.3 V to +33 V
AGND, GNDSWx to DGND
−0.3 V to +0.3 V
Operating Temperature Range (TA)
Industrial1
−40°C to +105°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature (TJ max)
125°C
Power Dissipation
(TJ max − TA)/θJA
Lead Temperature
JEDEC industry standard
Soldering
J-STD-020
1
Power dissipated on chip must be derated to keep the junction temperature
below 125°C.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Junction-to-air thermal resistance (θJA) is specified for a JEDEC
4-layer test board.
Table 5. Thermal Resistance
Package Type
θJA
Unit
64-Lead LFCSP (CP-64-3)
20
°C/W
ESD CAUTION


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