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AD5116 bảng dữ liệu(PDF) 10 Page - Analog Devices |
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AD5116 bảng dữ liệu(HTML) 10 Page - Analog Devices |
10 / 24 page AD5111/AD5113/AD5115 Data Sheet Rev. 0 | Page 10 of 24 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 6. Parameter Rating VDD to GND –0.3 V to +7.0 V VLOGIC to GND –0.3 V to +7.0 V VA, VW, VB to GND GND − 0.3 V to VDD + 0.3 V IA, IW, IB Pulsed1 Frequency > 10 kHz RAW = 5 kΩ and 10 kΩ ±6 mA/d2 RAW = 80 kΩ ±1.5 mA/d2 Frequency ≤ 10 kHz RAW = 5 kΩ and 10 kΩ ±6 mA/√d2 RAW = 80 kΩ ±1.5 mA/√d2 Continuous RAW = 5 kΩ and 10 kΩ ±6 mA RAW = 80 kΩ ±1.5 mA Digital Inputs U/D, CLK, and CS −0.3 V to +7 V or VDD + 0.3 V (whichever is less) Operating Temperature Range3 −40°C to +125°C Maximum Junction Temperature (TJ Max) 150°C Storage Temperature Range −65°C to +150°C Reflow Soldering Peak Temperature 260°C Time at Peak Temperature 20 sec to 40 sec Package Power Dissipation (TJ max − TA)/θJA 1 Maximum terminal current is bounded by the maximum current handling of the switches, maximum power dissipation of the package, and maximum applied voltage across any two of the A, B, and W terminals at a given resistance. 2 Pulse duty factor. 3 Includes programming of EEPROM memory. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is defined by JEDEC specification JESD-51, and the value is dependent on the test board and test environment. Table 7. Thermal Resistance Package Type θJA θJC Unit 8-Lead LFCSP 901 25 °C/W 1 JEDEC 2S2P test board, still air (0 m/sec air flow). ESD CAUTION |
Số phần tương tự - AD5116 |
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Mô tả tương tự - AD5116 |
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