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STPS30L60CW-N3 bảng dữ liệu(PDF) 2 Page - Vishay Siliconix |
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STPS30L60CW-N3 bảng dữ liệu(HTML) 2 Page - Vishay Siliconix |
2 / 7 page VS-STPS30L60CWPbF, VS-STPS30L60CW-N3 www.vishay.com Vishay Semiconductors Revision: 30-Aug-11 2 Document Number: 94329 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Note (1) Pulse width < 300 μs, duty cycle < 2 % ELECTRICAL SPECIFICATIONS PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS Maximum forward voltage drop per leg See fig. 1 VFM (1) 15 A TJ = 25 °C 0.60 V 30 A 0.80 15 A TJ = 125 °C 0.56 30 A 0.70 Maximum reverse leakage current per leg See fig. 2 IRM (1) TJ = 25 °C VR = Rated VR 0.48 mA TJ = 125 °C 50 (typical) 100 Maximum junction capacitance per leg CT VR = 5 VDC (test signal range 100 kHz to 1 MHz) 25 °C 720 pF Typical series inductance per leg LS Measured lead to lead 5 mm from package body 7.5 nH Maximum voltage rate of change dV/dt Rated VR 10 000 V/µs THERMAL - MECHANICAL SPECIFICATIONS PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS Maximum junction and storage temperature range TJ, TStg - 55 to 150 °C Maximum thermal resistance, junction to case per leg RthJC DC operation See fig. 4 2.20 °C/W Maximum thermal resistance, junction to case per package DC operation 1.10 Typical thermal resistance, case to heatsink RthCS Mounting surface, smooth and greased 0.24 Approximate weight 6g 0.21 oz. Mounting torque minimum Non-lubricated threads 6 (5) kgf · cm (lbf · in) maximum 12 (10) Marking device Case style TO-247AC (JEDEC) STPS30L60CW |
Số phần tương tự - STPS30L60CW-N3 |
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Mô tả tương tự - STPS30L60CW-N3 |
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