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BYV26EGP bảng dữ liệu(PDF) 2 Page - Vishay Siliconix |
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BYV26EGP bảng dữ liệu(HTML) 2 Page - Vishay Siliconix |
2 / 5 page www.vishay.com For technical questions within your region, please contact one of the following: Document Number: 88554 2 DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com Revision: 15-Mar-11 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 BYV26DGP, BYV26EGP Vishay General Semiconductor Notes (1) Thermal resistance from junction to ambient at 0.375" (9.5 mm) lead length, mounted on PCB with 0.5" x 0.5" (12 mm x 12 mm) copper pads (2) Thermal resistance from junction to lead at 0.375" (9.5 mm) lead length with both leads attached to heatsink Note (1) AEC-Q101 qualified RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted) Fig. 1 - Maximum Forward Current Derating Curve Fig. 2 - Forward Power Loss Characteristics ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL BYV26DGP BYV26EGP UNIT Minimum avalanche breakdown voltage 100 μA VBR 900 1100 V Maximum instantaneous forward voltage 1.0 A TJ = 25 °C VF 2.5 V TJ = 175 °C 1.3 Maximum DC reverse current at rated DC blocking voltage TA = 25 °C IR 5.0 μA TA = 165 °C 150 Max. reverse recovery time IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A trr 75 ns Typical junction capacitance 4.0 V, 1 MHz CJ 15 pF THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL BYV26DGP BYV26EGP UNIT Typical thermal resistance RJA (1) 70 °C/W RJL (2) 16 ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE BYV26EGP-E3/54 0.428 54 4000 13" diameter paper tape and reel BYV26EGP-E3/73 0.428 73 2000 Ammo pack packaging BYV26EGPHE3/54 (1) 0.428 54 4000 13" diameter paper tape and reel BYV26EGPHE3/73 (1) 0.428 73 2000 Ammo pack packaging 0 25 50 75 100 125 150 175 0 0.2 0.4 0.6 0.8 1.0 1.2 Lead Mounted on Heatsinks T A = Ambient Temperature Temperature (°C) Mounted on P.C.B. 0.375" (9.5 mm) Lead Length on 0.47" x 0.47" (12 mm x 12 mm) Copper Pads T L = Lead Temperature Resistive or Inductive Load 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 0.2 0.4 0.6 0.8 1.0 1.2 Average Forward Current (A) D = t p/T t p T D = 0.1 D = 0.2 D = 0.3 D = 0.5 D = 0.8 D = 1.0 |
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Mô tả tương tự - BYV26EGP |
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