BYV26EGP datasheet(2/5 Pages) VISHAY

tên linh kiện	BYV26EGP

Giải thích chi tiết về linh kiện	Glass Passivated Ultrafast Rectifier

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For technical questions within your region, please contact one of the following:

Document Number: 88554

2

DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com

Revision: 15-Mar-11

This datasheet is subject to change without notice.

THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

BYV26DGP, BYV26EGP

Vishay General Semiconductor

Notes

(1) Thermal resistance from junction to ambient at 0.375" (9.5 mm) lead length, mounted on PCB with 0.5" x 0.5" (12 mm x 12 mm) copper pads

(2) Thermal resistance from junction to lead at 0.375" (9.5 mm) lead length with both leads attached to heatsink

Note

(1) AEC-Q101 qualified

RATINGS AND CHARACTERISTICS CURVES

(TA = 25 °C unless otherwise noted)

Fig. 1 - Maximum Forward Current Derating Curve

Fig. 2 - Forward Power Loss Characteristics

ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)

PARAMETER

TEST CONDITIONS

SYMBOL

BYV26DGP

BYV26EGP

UNIT

Minimum avalanche

breakdown voltage

100 μA

VBR

900

1100

V

Maximum instantaneous

forward voltage

1.0 A

TJ = 25 °C

VF

2.5

V

TJ = 175 °C

1.3

Maximum DC reverse current at

rated DC blocking voltage

TA = 25 °C

IR

5.0

μA

TA = 165 °C

150

Max. reverse recovery time

IF = 0.5 A, IR = 1.0 A,

Irr = 0.25 A

trr

75

ns

Typical junction capacitance

4.0 V, 1 MHz

CJ

15

pF

THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)

PARAMETER

SYMBOL

BYV26DGP

BYV26EGP

UNIT

Typical thermal resistance

RJA (1)

70

°C/W

RJL (2)

16

ORDERING INFORMATION (Example)

PREFERRED P/N

UNIT WEIGHT (g)

PREFERRED PACKAGE CODE

BASE QUANTITY

DELIVERY MODE

BYV26EGP-E3/54

0.428

54

4000

13" diameter paper tape and reel

BYV26EGP-E3/73

0.428

73

2000

Ammo pack packaging

BYV26EGPHE3/54 (1)

0.428

54

4000

13" diameter paper tape and reel

BYV26EGPHE3/73 (1)

0.428

73

2000

Ammo pack packaging

0

25

50

75

100

125

150

175

0

0.2

0.4

0.6

0.8

1.0

1.2

Lead Mounted

on Heatsinks

T

A = Ambient Temperature

Temperature (°C)

Mounted on P.C.B.

0.375" (9.5 mm) Lead Length on

0.47" x 0.47" (12 mm x 12 mm)

Copper Pads

T

L = Lead Temperature

Resistive or

Inductive Load

0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

0

0.2

0.4

0.6

0.8

1.0

1.2

Average Forward Current (A)

D = t

p/T

t

p

T

D = 0.1

D = 0.2

D = 0.3

D = 0.5

D = 0.8

D = 1.0

Số phần tương tự - BYV26EGP

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
Vishay Siliconix	BYV26EGP	38Kb / 2P	Glass Passivated Ultrafast Rectifier 07-Mar-02
Vishay Siliconix	BYV26EGP	111Kb / 5P	Glass Passivated Ultrafast Rectifier Revision: 20-Aug-07
Gulf Semiconductor	BYV26EGP	84Kb / 2P	SINTERED GLASS JUNCTION FAST SWITCHING PLASTIC RECTIFIER VOLTAGE竊?200V to 1000V CURRENT: 1.0A
Shenzhen Taychipst Elec...	BYV26EGP	4Mb / 2P	SINTERED GLASS JUNCTION FAST SWITCHING PLASTIC RECTIFIER
SUNMATE electronic Co.,...	BYV26EGP	307Kb / 2P	SUPER FAST RECTIFIER DIODES

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