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ADS5263_1110 bảng dữ liệu(PDF) 7 Page - Texas Instruments |
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ADS5263_1110 bảng dữ liệu(HTML) 7 Page - Texas Instruments |
7 / 75 page ADS5263 www.ti.com SLAS760B – MAY 2011 – REVISED OCTOBER 2011 PACKAGE/ORDERING INFORMATION(1) SPECIFIED PACKAGE TRANSPORT PACKAGE- LEAD/BALL PACKAGE PRODUCT TEMPERATURE ORDERING NUMBER LEAD FINISH MARKING DESIGNATOR MEDIA, QTY RANGE ADS5263IRGCT ADS5263 ADS5263IRGCR ADS5263 QFN-64 RGC –40°C to 85°C Cu Matte Sn Tape and reel ADS5263IRGCT-NM ADS5263NM ADS5263IRGCR-NM (1) Eco Plan – The planned eco-friendly classification: ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT Supply voltage range, AVDD –0.3 V to 3.9 V Supply voltage range, LVDD –0.3 V to 2.2 V Voltage between AGND and DRGND –0.3 to 0.3 V Voltage applied to analog input pins – INP_A, INM_A, INP_B, INM_B –0.3V to minimum (3.6, AVDD + 0.3 V) V Voltage applied to input pins – CLKP, CLKM(2), RESET, SCLK, SDATA, CSZ –0.3 V to AVDD + 0.3 V V Voltage applied to reference input pins –0.3 to 2.8 V Operating free-air temperature range, TA –40 to 85 °C Operating junction temperature range, TJ 125 °C Storage temperature range, Tstg –65 to 150 °C ESD, human body model 2 kV (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. (2) When AVDD is turned off, it is recommended to switch off the input clock (or ensure the voltage on CLKP, CLKM is < |0.3V|. This prevents the ESD protection diodes at the clock input pins from turning on. THERMAL INFORMATION ADS5263 THERMAL METRIC(1) QFN UNITS 64 PINS θJA Junction-to-ambient thermal resistance 20.6 θJCtop Junction-to-case (top) thermal resistance 6.1 θJB Junction-to-board thermal resistance 2.7 °C/W ψJT Junction-to-top characterization parameter 0.2 ψJB Junction-to-board characterization parameter 2.6 θJCbot Junction-to-case (bottom) thermal resistance 0.4 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Link(s) :ADS5263 |
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