MC74HCT541A

High–Speed CMOS Logic Data

DL129 — Rev 6

3–5

MOTOROLA

OUTLINE DIMENSIONS

N SUFFIX

PLASTIC PACKAGE

CASE 738–03

ISSUE E

DW SUFFIX

PLASTIC SOIC PACKAGE

CASE 751D–04

ISSUE E

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD

FLASH.

M

L

M

B

M

0.25 (0.010)

T

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

25.66

27.17

1.010

1.070

B

6.10

6.60

0.240

0.260

C

3.81

4.57

0.150

0.180

D

0.39

0.55

0.015

0.022

G

2.54 BSC

0.100 BSC

J

0.21

0.38

0.008

0.015

K

2.80

3.55

0.110

0.140

L

7.62 BSC

0.300 BSC

M

0

15

0

15

N

0.51

1.01

0.020

0.040

_

_

_

_

E

1.27

1.77

0.050

0.070

1

11

10

20

–A–

SEATING

PLANE

K

N

F

G

–T–

M

A

M

0.25 (0.010)

T

E

B

C

F

1.27 BSC

0.050 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.150

(0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.13

(0.005) TOTAL IN EXCESS OF D DIMENSION

AT MAXIMUM MATERIAL CONDITION.

–A–

–B–

20

1

11

10

S

A

M

0.010 (0.25)

T

D

20X

M

B

M

0.010 (0.25)

P

10X

J

F

G

18X

K

C

PLANE

M

_

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

12.65

12.95

0.499

0.510

B

7.40

7.60

0.292

0.299

C

2.35

2.65

0.093

0.104

D

0.35

0.49

0.014

0.019

F

0.50

0.90

0.020

0.035

G

1.27 BSC

0.050 BSC

J

0.25

0.32

0.010

0.012

K

0.10

0.25

0.004

0.009

M

0

7

0

7

P

10.05

10.55

0.395

0.415

R

0.25

0.75

0.010

0.029

_

_

_

_

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MC74HCT541A/D

*MC74HCT541A/D*