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BD00KA5WF bảng dữ liệu(PDF) 5 Page - Rohm

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Giải thích chi tiết về linh kiện  500mA Secondary LDO Regulators for Local Power Supplies
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BD□□KA5,BD□□KA5W Series,BD00KA5W Series
Technical Note
5/9
www.rohm.com
2009.04 - Rev.A
© 2009 ROHM Co., Ltd. All rights reserved.
Input / Output Equivalent Circuit Diagrams
Thermal Design
When using at temperatures over Ta=25℃, please refer to the power dissipation shown in Fig.20 through 22.
The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the
maximum junction temperature TjMAX, the device may malfunction or be destroyed. The heat of the IC requires sufficient
consideration regarding instantaneous destruction and long-term operation reliability. In order to protect the IC from thermal
damage, it is necessary to operate it at temperatures less than the maximum junction temperature TjMAX.
Even when the ambient temperature Ta is a normal temperature(25℃), the chip(junction) temperature Tj may be quite high,
so please operate the IC at temperatures less than the acceptable loss Pd.
The calculation method for power consumption Pc(W) is as follows :
Pc = (Vcc-Vo)×Io+Vcc×Icca
Acceptable loss Pd≧Pc
Solving for the load current IO in order to operate within the acceptable loss,
Io≦
It is then possible to find the maximum load current IoMAX with respect to the applied voltage Vcc at the time of thermal design.
Calculation Example
Example 1) When Ta=85℃, Vcc=2.5V, Vo=1.0V
Io≦
θja=96.2℃/W → -10.4mW/℃
Io≦440mA (Icca : 2mA)
25℃=1300mW → 85℃=676mW
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges.
The power consumption PC of the IC when there is a short circuit (short between Vo and GND) is :
Pc=Vcc×(Icca+Ishort)
*Ishort : Short circuit current
With BD00KA5WFP/WF,R1and R2 are connected
outside the IC between ADJ and GND and
between OUT and ADJ.
Vcc
CTL
Vcc Vcc
Vcc
OUT
ADJ
R1
R2
31.25kΩ 2kΩ
25kΩ
(BD00KA5WFP/WF)
Fig.18
Fig.19
Pd – Vcc×Icca
Vcc-Vo
0.676-2.5×Icca
2.5-1.0
BA10KA5WFP(TO252-5 packaging)
0.0
0.4
0.8
1.2
1.6
2.0
0
25
50
75
100
125
150
Ambient temperature:Ta(℃)
0.0
0.4
0.8
1.2
1.6
2.0
0
25
50
75
100
125
150
周囲温度:Ta(℃)
0
200
400
600
800
1000
0
25
50
75
100
125
150
周囲温度:Ta(℃)
1.30
1.20
687.6mW
562.6mW
(1)
(2)
Rohm standard board mounting
Board size:70×70×1.6mm
Copper foil area:7×7mm
2
θ
ja=96.2(℃/W)
Rohm standard board mounting
Board size:70×70×1.6mm
Copper foil area:7×7mm
2
θ
ja=104.2(℃/W)
TO252-5
TO252-3
SOP8
Fig.22 Power Dissipation heat
reducing characteristics
(1)When using a standard board:
θ
j-c=181.8(℃/W)
(2) When using an IC alone
θ
j-a=222.2(℃/W)
Fig.21 Power Dissipation heat
reducing characteristics
Fig.20 Power Dissipation heat
reducing characteristics
Ambient temperature:Ta(℃)
Ambient temperature:Ta(℃)
Vcc:
Vo:
Io:
Icca:
Input voltage
Output voltage
Load current
Circuit current


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