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AD9146-M5375-EBZ bảng dữ liệu(PDF) 7 Page - Analog Devices |
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7 / 52 page AD9146 Rev. 0 | Page 7 of 52 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 6. Parameter Rating AVDD33 to AVSS, EPAD, CVSS −0.3 V to +3.6 V DVDD18, CVDD18 to AVSS, EPAD, CVSS −0.3 V to +2.1 V AVSS to EPAD, CVSS −0.3 V to +0.3 V EPAD to AVSS, CVSS −0.3 V to +0.3 V CVSS to AVSS, EPAD −0.3 V to +0.3 V FSADJ, REFIO, IOUT1P, IOUT1N, IOUT2P, IOUT2N to AVSS −0.3 V to AVDD33 + 0.3 V D[7:0]P, D[7:0]N, FRAMEP, FRAMEN, DCIP, DCIN to EPAD −0.3 V to DVDD18 + 0.3 V DACCLKP, DACCLKN, REFCLKP, REFCLKN to EPAD −0.3 V to CVDD18 + 0.3 V RESET, IRQ, CS, SCLK, SDIO to EPAD −0.3 V to DVDD18 + 0.3 V Junction Temperature 125°C Storage Temperature Range −65°C to +150°C The exposed pad (EPAD) of the 48-lead LFCSP must be soldered to the ground plane (AVSS). The EPAD provides an electrical, thermal, and mechanical connection to the board. Typical θJA, θJB, and θJC values are specified for a 4-layer board and an 8-layer board in still air. Airflow increases heat dissipation, effectively reducing θJA and θJB. Table 7. Thermal Resistance Package1 PCB θJA θJB θJC Unit 48-Lead LFCSP 4-layer 23.2 8.5 8.7 °C/W 48-Lead LFCSP 8-layer 16.4 3.9 7.1 °C/W 1 EPAD soldered to ground plane. ESD CAUTION Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. |
Số phần tương tự - AD9146-M5375-EBZ |
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Mô tả tương tự - AD9146-M5375-EBZ |
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