SPI-236-17

No.6025 5/6

Package dimensions and Pin connection

As stated in the sttached paper. (No.6025 4/6)

Soldering conditions

(1) Temperature

: Max. 260

°C

(2) Time

: Max. 3 sec

(3) Clearance

: Min. 1mm from stay (include PCB thickness)

(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.

q Bending a lead must be done before soldering.

w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that

stress for the regin part cause troubles such as gold wire breaking and so on.

e A lead must be bend under the stay.

r Do not bend the same position of leads more than twice.

(2) The hole pitch of a circuit board must fit to the lead pitch.

(3) Two stays coupling LED and Ph. Tr should be isolated from any PCB pattern or any lead.

(4) Take core the following when soldering.

q Do not heat a product under any stress (a twist and so on) to leads.

w Do not heat a product in the states of operating force to the regin part.

(5) Use the flux which contain no chlorine, have no corrosion and do not need washing.

(6) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.

PRECAUTIONS