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ISL22316UFU10Z bảng dữ liệu(PDF) 3 Page - Intersil Corporation |
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3 / 15 page 3 FN6186.2 September 1, 2009 Absolute Maximum Ratings Thermal Information Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Voltage at any Digital Interface Pin with Respect to GND . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC+0.3 VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V Voltage at any DCP Pin with Respect to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC IW (10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA Latchup (Note 1) . . . . . . . . . . . . . . . . . . Class II, Level B @ +125°C ESD Ratings Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5kV Charge Device Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1kV Thermal Resistance (Typical) θJA (°C/W) θJC(°C/W) 10 Lead MSOP (Note 2). . . . . . . . . . . . 162 N/A 10 Lead TDFN (Notes 3, 4) . . . . . . . . . 74 7 Maximum Junction Temperature (Plastic Package). . . . . . . . +150°C Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Recommended Operating Conditions Temperature Range (Extended Industrial). . . . . . . . -40°C to +125°C VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V Power Rating of each DCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mW Wiper Current of each DCP . . . . . . . . . . . . . . . . . . . . . . . . . . ±3.0mA CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 1. Jedec Class II pulse conditions and failure criterion used. Level B exceptions are: using a max positive pulse of 6.5V on the SHDN pin, and using a max negative pulse of -1V for all pins. 2. θ JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 3. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 4. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Analog Specifications Over recommended operating conditions, unless otherwise stated. SYMBOL PARAMETER TEST CONDITIONS MIN (Note 19) TYP (Note 5) MAX (Note 19) UNIT RTOTAL RH to RL Resistance W option 10 k Ω U option 50 k Ω RH to RL Resistance Tolerance -20 +20 % End-to-End Temperature Coefficient W option ±50 ppm/°C (Note 18) U option ±80 ppm/°C (Note 18) RW Wiper Resistance VCC = 3.3V, wiper current = VCC/RTOTAL 70 200 Ω VRH, VRL VRH and VRL Terminal Voltages VRH and VRL to GND 0 VCC V CH/CL/CW (Note 18) Potentiometer Capacitance 10/10/25 pF ILkgDCP Leakage on DCP Pins Voltage at pin from GND to VCC 0.1 1 µA VOLTAGE DIVIDER MODE (0V @ RL; VCC @ RH; measured at RW, unloaded) INL (Note 10) Integral Non-linearity Monotonic over all tap positions, W and U option -1 1 LSB (Note 6) DNL (Note 9) Differential Non-linearity Monotonic over all tap positions, W and U option -0.5 0.5 LSB (Note 6) ZSerror (Note 7) Zero-scale Error W option 0 1 5 LSB (Note 6) U option 0 0.5 2 FSerror (Note 8) Full-scale Error W option -5 -1 0 LSB (Note 6) U option -2 -1 0 TCV (Notes 11, 18) Ratiometric Temperature Coefficient DCP register set to 40 hex for W and U option ±4 ppm/°C ISL22316 |
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