công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
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SC627 bảng dữ liệu(PDF) 16 Page - Semtech Corporation |
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SC627 bảng dữ liệu(HTML) 16 Page - Semtech Corporation |
16 / 23 page SC627 16 PCB Layout Considerations The layout diagram in Figure 1 illustrates a proper two-layer PCB layout for the SC627 and supporting components. Following fundamental layout rules is critical for achieving the performance specified in the Electrical Characteristics table. The following guidelines are recommended when developing a PCB layout: Place all bypass and decoupling capacitors — C1, C2, CIN, COUT, CLDO1, CLDO2, and CBYP as close to the device as possible. All charge pump current passes through VIN, VOUT, and the bucket capacitor connection pins. Ensure that all connections to these pins make use of wide traces so that the resistive drop on each connection is minimized. The thermal pad should be connected to the ground plane using multiple vias to ensure proper thermal connection for optimal heat transfer. • • • Applications Information (continued) Make all ground connections to a solid ground plane as shown in the example layout (Figure 3). If a ground layer is not feasible, the following groupings should be connected: PGND — CIN, COUT AGND — Ground Pad, CLDO1, CLDO2, CBYP If no ground plane is available, PGND and AGND should be routed back to the negative battery terminal as separate signals using thick traces. Joining the two ground returns at the terminal prevents large pulsed return currents from mixing with the low-noise return currents of the LDOs. Both LDO output traces should be made as wide as possible to minimize resistive losses. • • • • COUT C1 C2 CIN CBYP CLDO2 BL1 BL2 LDO1 LDO2 BYP C2- SWIF SC627 FL GND CLDO1 GND PGND NC Figure 1 — Recommended PCB Layout Figure 2 — Layer 1 Figure 3 — Layer 2 |
Số phần tương tự - SC627_09 |
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Mô tả tương tự - SC627_09 |
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