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74VMEH22501DGGRG4 bảng dữ liệu(PDF) 2 Page - Texas Instruments |
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74VMEH22501DGGRG4 bảng dữ liệu(HTML) 2 Page - Texas Instruments |
2 / 31 page SN74VMEH22501 SCES357F – JULY 2001 – REVISED FEBRUARY 2010 www.ti.com DESCRIPTION/ORDERING INFORMATION (CONTINUED) High-speed backplane operation is a direct result of the improved OEC™ circuitry and high drive that has been designed and tested into the VME64x backplane model. The B-port I/Os are optimized for driving large capacitive loads and include pseudo-ETL input thresholds (½ VCC ± 50 mV) for increased noise immunity. These specifications support the 2eVME protocols in VME64x (ANSI/VITA 1.1) and 2eSST protocols in VITA 1.5. With proper design of a 21-slot VME system, a designer can achieve 320-Mbyte transfer rates on linear backplanes and, possibly, 1-Gbyte transfer rates on the VME320 backplane. All inputs and outputs are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. Active bus-hold circuitry holds unused or undriven 3A-port inputs at a valid logic state. Bus-hold circuitry is not provided on 1A or 2A inputs, any B-port input, or any control input. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioff circuitry prevents damaging current to backflow through the device when it is powered off/on. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCC circuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability. When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, output-enable (OE and OEBY) inputs should be tied to VCC through a pullup resistor and output-enable (OEAB) inputs should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the drive capability of the device connected to this input. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING BGA MicroStar™ Tape and reel SN74VMEH22501ZQLR VK501 Junior – ZQL TSSOP – DGG Tape and reel SN74VMEH22501DGGR VMEH22501 0°C to 85°C TVSOP – DGV Tape and reel SN74VMEH22501DGVR VK501 VFBGA – GQL Tape and reel SN74VMEH22501GQLR VK501 (1) Package drawings, thermal data, and symbolization are available at www.ti.com/sc/packaging. 2 Submit Documentation Feedback Copyright © 2001–2010, Texas Instruments Incorporated Product Folder Link(s): SN74VMEH22501 |
Số phần tương tự - 74VMEH22501DGGRG4 |
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Mô tả tương tự - 74VMEH22501DGGRG4 |
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