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ST60X-18S-CV1 bảng dữ liệu(PDF) 11 Page - Hirose Electric |
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ST60X-18S-CV1 bảng dữ liệu(HTML) 11 Page - Hirose Electric |
11 / 11 page 11 ST Series ●Interface Connectors for Miniature, Portable Terminal Devices BRecommended Temperature Profile (Lead-free soldering compound) (ç) 250 240ç 230ç min 180ç 150ç 200 150 100 60S 30S 50 HRS test conditions Solder composition: Paste, 96.5%Sn/3.0%Ag/0.5%Cu Test board: Glass epoxy 35mm∞35mm∞0.8mm thick The temperature profiles are based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. |
Số phần tương tự - ST60X-18S-CV1 |
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Mô tả tương tự - ST60X-18S-CV1 |
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