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4 / 28 page ADXRS450 Preliminary Technical Data Rev. PrA | Page 4 of 28 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating Acceleration (Any Axis, Unpowered, 0.5 ms) 2000 g Acceleration (Any Axis, Powered, 0.5 ms) 2000 g Supply Voltage (PDD) −0.3 V to +6.0 V Output Short-Circuit Duration (Any Pin to Ground) Indefinite Temperature Range Operating LCC_V Package −40°C to +125°C SOIC_CAV Package −40°C to +125°C Storage LCC_V Package −65°C to +150°C SOIC_CAV Package −40°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, for a device soldered in a printed circuit board (PCB) for surface-mount packages. Table 3. Thermal Resistance Package Type θJA θJC Unit 16-Lead SOIC_CAV 191.5 25 °C/W 14-Lead Ceramic LCC_V 185.5 23 °C/W RATE SENSITIVE AXIS The ADXRS450 is available in two package options. The SOIC_CAV package configuration is for applications that require a Z-axis (yaw) rate sensing device. The device transmits a positive going LSB count for clockwise rotation about the axis normal to the package top. Conversely, a negative going LSB count is transmitted for counterclockwise rotation about the Z-zxis. The vertical mount package (LCC_V) option is for applications that require rate sensing in the axes parallel to the plane of the PCB (pitch and roll). The same principles of LSB count transmission for clockwise and counterclockwise rotation about the parallel axes apply to the LCC_V option. See Figure 2 for details. RATE AXIS LONGITUDINAL AXIS LATERAL AXIS VMP PACKAGE + A BCD G 1 1 7 7 8 EF Z-AXIS A1 RATE AXIS + Figure 2. Rate Signal Increases with Clockwise Rotation ESD CAUTION |
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