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ADS4129IRGZT bảng dữ liệu(PDF) 5 Page - Texas Instruments |
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ADS4129IRGZT bảng dữ liệu(HTML) 5 Page - Texas Instruments |
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5 / 77 page  ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483D – NOVEMBER 2009 – REVISED APRIL 2010 ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. VALUE UNIT Supply voltage range, AVDD –0.3 to 2.1 V Supply voltage range, DRVDD –0.3 to 2.1 V Voltage between AGND and DRGND –0.3 to 0.3 V Voltage between AVDD to DRVDD (when AVDD leads DRVDD) 0 to 2.1 V Voltage between DRVDD to AVDD (when DRVDD leads AVDD) 0 to 2.1 V INP, INM –0.3 to minimum (1.9, AVDD + 0.3) V Voltage applied to input pins CLKP, CLKM(2), DFS, OE –0.3 to AVDD + 0.3 V RESET, SCLK, SDATA, SEN –0.3 to 3.9 V Operating free-air temperature range, TA –40 to +85 °C Operating junction temperature range, TJ +125 °C Storage temperature range, TSTG –65 to +150 °C ESD, human body model (HBM) 2 kV (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) When AVDD is turned off, it is recommended to switch off the input clock (or ensure the voltage on CLKP, CLKM is less than |0.3V|. This prevents the ESD protection diodes at the clock input pins from turning on. THERMAL CHARACTERISTICS (1) PARAMETER TEST CONDITIONS TYPICAL VALUE UNIT Soldered thermal pad, no airflow 29 °C/W RqJA (2) Soldered thermal pad, 200LFM 22 °C/W RqJT (3) Bottom of package (thermal pad) 1.13 °C/W (1) With a JEDEC standard high-K board and 5×5 via array. See the Exposed Pad section in the Application Information. (2) RqJA is the thermal resistance from junction to ambient. (3) RqJT is the thermal resistance from junction to the thermal pads. Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 |
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