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3 / 21 page 3 FN6934.4 May 25, 2010 Absolute Maximum Ratings Thermal Information Max Voltage VIN to GND . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6.5V VIN to GND (ISL21080-41 and 50 only) . . . -0.5V to +10V VOUT to GND (10s) . . . . . . . . . . . . . . -0.5V to VOUT +1V VOUT to GND (10s) ISL21080-41 and 50 only . . . . . . . . . . -0.5V to +5.1V ESD Ratings Human Body Model (Tested to JESD22-A114) . . . . . . . 5kV Machine Model (Tested to JESD22-A115) . . . . . . . . . 500V Charged Device Model (Tested to JESD22-C101) . . . . . 2kV Latch Up (Tested per JESD-78B; Class 2, Level A) . . . 100mA Environmental Operating Conditions X-Ray Exposure (Note 4). . . . . . . . . . . . . . . . . . . .10mRem Thermal Resistance (Typical, Notes 5, 6) θJA (°C/W) θJC (°C/W) 3 Lead SOT-23 . . . . . . . . . . . . . . . 275 110 Maximum Junction Temperature . . . . . . . . . . . . . . . +107°C Continuous Power Dissipation (TA = +85°C). . . . . . . . 99mW Storage Temperature Range . . . . . . . . . . . -65°C to +150°C Pb-Free Reflow Profile (Note 7). . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Recommended Operating Conditions Temperature. . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . .2.7V to 5.5V CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. Measured with no filtering, distance of 10” from source, intensity set to 55kV and 70mA current, 30s duration. Other exposure levels should be analyzed for Output Voltage drift effects. See “Applications Information” on page 14. 5. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 6. For θJC, the “case temp” location is taken at the package top center. 7. Post-reflow drift for the ISL21080 devices will range from 100µV to 1.0mV based on experimental results with devices on FR4 double sided boards. The design engineer must take this into account when considering the reference voltage after assembly. 8. Post-assembly x-ray inspection may also lead to permanent changes in device output voltage and should be minimized or avoided. Initial accuracy can change 10mV or more under extreme radiation. Most inspection equipment will not affect the FGA reference voltage, but if x-ray inspection is required, it is advisable to monitor the reference output voltage to verify excessive shift has not occurred. Electrical Specifications (ISL21080-09, VOUT = 0.9V) VIN = 3.0V, TA = -40°C to +85°C, IOUT = 0, unless otherwise specified. Boldface limits apply over the operating temperature range, -40°C to +85°C. PARAMETER DESCRIPTION CONDITIONS MIN (Note 12) TYP MAX (Note 12) UNIT VOUT Output Voltage 0.9 V VOA VOUT Accuracy @ TA = +25°C (Notes 7, 8) -0.7 +0.7 % TC VOUT Output Voltage Temperature Coefficient (Note 9) 50 ppm/°C VIN Input Voltage Range 2.0 5.5 V IIN Supply Current 0.35 1.5 µA ΔVOUT /ΔVIN Line Regulation 2V < VIN < 5.5V 30 350 µV/V ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA ≤ IOUT ≤ 10mA 6 100 µV/mA Sinking: -10mA ≤ IOUT ≤ 0mA 23 350 µV/mA ISC Short Circuit Current TA = +25°C, VOUT tied to GND 30 mA tR Turn-on Settling Time VOUT = ±0.1% with no load 1 ms Ripple Rejection f = 120Hz -40 dB eN Output Voltage Noise 0.1Hz ≤ f ≤ 10Hz 40 µVP-P VN Broadband Voltage Noise 10Hz ≤ f ≤ 1kHz 10 µVRMS Noise Density f = 1kHz 1.1 µV/√Hz ΔVOUT/ΔTA Thermal Hysteresis (Note 10) ΔTA = +125°C 100 ppm ΔVOUT/Δt Long Term Stability (Note 11) TA = +25°C 60 ppm ISL21080 |
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