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ADS1209 bảng dữ liệu(PDF) 2 Page - Texas Instruments |
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ADS1209 bảng dữ liệu(HTML) 2 Page - Texas Instruments |
2 / 20 page ADS1209 SBAS491 – FEBRUARY 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) SPECIFIED PACKAGE TEMPERATURE TRANSPORT MEDIA, PRODUCT PACKAGE-LEAD DESIGNATOR RANGE ORDERING NUMBER QUANTITY ADS1209SPW Tube, 60 ADS1209 TSSOP-24 PW –40°C to +105°C ADS1209SPWR Tape and Reel, 2000 (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating ambient temperature range, unless otherwise noted. ADS1209 UNIT Supply voltage, AVDD to AGND –0.3 to 6 V Supply voltage, BVDD to BGND –0.3 to 6 V Analog input voltage AGND – 0.3 to AVDD + 0.3 V Reference input voltage AGND – 0.3 to AVDD + 0.3 V Digital input voltage BGND – 0.3 to BVDD + 0.3 V Ground voltage difference, AGND to BGND ±0.3 V Input current to any pin except supply ±10 mA Operating virtual junction temperature range, TJ –40 to +150 °C Operating ambient temperature range, TOA –40 to +125 °C Human body model (HBM) JEDEC standard 22, test method A114-C.01 +2000 V ESD ratings, all pins Charged device model (CDM) JEDEC standard 22, test method C101 +500 V (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATINGS TA ≤ +25°C DERATING FACTOR TA = +70°C TA = +85°C TA = +105°C PACKAGE POWER RATING ABOVE TA = +25°C (1) POWER RATING POWER RATING POWER RATING TSSOP-24 1420mW 11.3mW/°C 909mW 738mW 511mW (1) This is the inverse of the traditional junction-to-ambient thermal resistance (RqJA). Thermal resistances are not production tested and are for informational purposes only. THERMAL CHARACTERISTICS: TSSOP-24 Over the operating ambient temperature range of –40°C to +105°C, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RqJA Junction-to-air thermal resistance High-K thermal resistance(1) 88 °C/W RqJC Junction-to-case thermal resistance 26 °C/W PD Device power dissipation CLKSEL = 0, 5V supply 100 mW (1) Modeled in accordance with the High-K thermal definitions of EIA/JESD51-3. 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): ADS1209 |
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