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MCP1791 bảng dữ liệu(PDF) 6 Page - Microchip Technology |
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MCP1791 bảng dữ liệu(HTML) 6 Page - Microchip Technology |
6 / 34 page MCP1790/MCP1791 DS22075A-page 6 © 2008 Microchip Technology Inc. Detect Threshold to PWRGD Active Time Delay TVDET-PWRG D — 235 — µs VOUT = VPWRGD_TH + 100 mV to VPWRGD_TH - 100 mV AC Performance Output Delay From SHDN TOR — 200 — µs SHDN = GND to VIN, VOUT = GND to 95% VR, COUT = 1.0 µF PWRGD Delay from SHDN TSHDN_PG — 400 — ns SHDN = VIN to GND, COUT = 1.0 µF Output Noise eN —1.2 — µV/ √Hz) I OUT = 50 mA, f = 1 kHz Power Supply Ripple Rejection Ratio PSRR dB VIN = 7.0V, CIN = 0 µF, IOUT = 10 mA, VINAC = 400 mVpp — 90 — f = 100 Hz — 75 — f = 1 kHz, VR = 5.0V — 80 — f = 1 kHz, VR = < 5.0V Thermal Shutdown Temperature TSD — 157 — °C Rising Temperature Thermal Shutdown Hysteresis ΔT SD — 20 — °C Falling Temperature Short Circuit Recovery Time tTHERM —0 — ms (Note 8) AC/DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, V IN = VOUT(MAX) + VDROPOUT(MAX), (Note 1), IOUT = 1 mA, COUT = 4.7 µF (X7R Ceramic), CIN = 4.7 µF (X7R Ceramic), TA = +25°C, SHDN > 2.4V. Boldface type applies for junction temperatures, T J (Note 5) of -40°C to +125°C. Parameters Symbol Min Typ Max Units Conditions Note 1: The minimum VIN, VIN(MIN) must meet two conditions: VIN ≥ 6.0V and VIN ≥ VOUT(MAX) + VDROPOUT(MAX). 2: VR is the nominal regulator output voltage. 3: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1 mA to the maximum specified output current. 4: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 165°C rating. Sustained junction temperatures above 165°C can impact the device reliability. 5: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant. 6: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its nominal value that was measured with an input voltage of VIN = VR + VDROPOUT(MAX). 7: Sustained junction temperatures above 165°C can impact the device reliability. 8: The Short Circuit Recovery Time test is done by placing the device into a short circuit condition and then removing the short circuit condition before the device die temperature reaches 125 °C. If the device goes into thermal shutdown, then the Short Circuit Recovery Time will depend upon the thermal dissipation properties of the package and circuit board. 9: TCVOUT = (VOUT-HIGH - VOUT-LOW) *10^6 / (VR * ΔTemperature), VOUT-HIGH = highest voltage measured over the tem- peraturerange. VOUT-LOW = lowest voltage measured over the temperature range. |
Số phần tương tự - MCP1791 |
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Mô tả tương tự - MCP1791 |
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