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LA16B-DGL-S3 bảng dữ liệu(PDF) 5 Page - LIGITEK electronics co., ltd. |
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LA16B-DGL-S3 bảng dữ liệu(HTML) 5 Page - LIGITEK electronics co., ltd. |
5 / 5 page Page 4/4 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solderability Test Solder Resistance Test This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Reference Standard 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles Low Temperature Storage Test High Temperature High Humidity Test Thermal Shock Test 1.Ta=65℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs High Temperature Storage Test Operating Life Test JIS C 7021: B-12 The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Test Condition Reliability Test: PART NO. LA16B/DGL-S3 Test Item LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Description |
Số phần tương tự - LA16B-DGL-S3 |
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Mô tả tương tự - LA16B-DGL-S3 |
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