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MC9S08MP16E2VWL bảng dữ liệu(PDF) 10 Page - Freescale Semiconductor, Inc |
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MC9S08MP16E2VWL bảng dữ liệu(HTML) 10 Page - Freescale Semiconductor, Inc |
10 / 36 page MC9S08MP16 Series Data Sheet, Rev. 1 Electrical Characteristics Freescale Semiconductor 10 2.4 Thermal Characteristics This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the MCU design. To take PI/O into account in power calculations, determine the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small. The average chip-junction temperature (TJ) in °C can be obtained from: TJ = TA + (PD × θJA) Eqn. 1 where: TA = Ambient temperature, °C θJA = Package thermal resistance, junction-to-ambient, °C/W PD = Pint + PI/O Pint = IDD × VDD, Watts — chip internal power PI/O = Power dissipation on input and output pins — user determined For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ (if PI/O is neglected) is: PD = K ÷ (TJ + 273°C) Eqn. 2 Solving Equation 1 and Equation 2 for K gives: K = PD × (TA + 273°C) + θJA × (PD) 2 Eqn. 3 Table 4. Thermal Characteristics Num C Rating Symbol Consumer & Industrial Automotive Unit 1 — Operating temperature range (packaged) TA –40 to 105 –40 to 125 °C 2 D Maximum junction temperature TJ 115 135 °C 3 D Thermal resistance 1,2 single-layer board 1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 2 Junction-to-ambient natural convection 48-pin LQFP θ JA 80 80 °C/W 32-pin LQFP 85 — 28-pin SOIC 71 — 4 D Thermal resistance 1,2 four-layer board 48-pin LQFP θ JA 56 56 °C/W 32-pin LQFP 57 — 28-pin SOIC 48 — |
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