MC9S08MP16E2VWL datasheet(10/36 Pages) FREESCALE

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MC9S08MP16 Series Data Sheet, Rev. 1

Electrical Characteristics

Freescale Semiconductor

10

2.4

Thermal Characteristics

This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power

dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and

it is user-determined rather than being controlled by the MCU design. To take PI/O into account in power calculations, determine

the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of

unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small.

The average chip-junction temperature (TJ) in °C can be obtained from:

TJ = TA + (PD × θJA)

Eqn. 1

where:

TA = Ambient temperature, °C

θJA = Package thermal resistance, junction-to-ambient, °C/W

PD = Pint + PI/O

Pint = IDD × VDD, Watts — chip internal power

PI/O = Power dissipation on input and output pins — user determined

For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ (if PI/O is neglected)

is:

PD = K ÷ (TJ + 273°C)

Eqn. 2

Solving Equation 1 and Equation 2 for K gives:

K = PD × (TA + 273°C) + θJA × (PD)

2

Eqn. 3

Table 4. Thermal Characteristics

Num

C

Rating

Symbol

Consumer &

Industrial

Automotive

Unit

1

—

Operating temperature range (packaged)

TA

–40 to 105

–40 to 125

°C

2

D

Maximum junction temperature

TJ

115

135

°C

3

D

Thermal resistance 1,2

single-layer board

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2 Junction-to-ambient natural convection

48-pin LQFP

θ

JA

80

°C/W

32-pin LQFP

85

—

28-pin SOIC

71

—

4

D

Thermal resistance 1,2

four-layer board

48-pin LQFP

θ

JA

56

°C/W

32-pin LQFP

57

—

28-pin SOIC

48

—

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nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
NXP Semiconductors	MC9S08MP16E2VWL	918Kb / 36P	MC9S08MP16 Series Data Sheet Rev. 2, 08/2011

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