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MC9S08QE32 bảng dữ liệu(PDF) 11 Page - Freescale Semiconductor, Inc

tên linh kiện MC9S08QE32
Giải thích chi tiết về linh kiện  8-Bit HCS08 Central Processor Unit (CPU)
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nhà sản xuất  FREESCALE [Freescale Semiconductor, Inc]
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MC9S08QE32 bảng dữ liệu(HTML) 11 Page - Freescale Semiconductor, Inc

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Electrical Characteristics
MC9S08QE32 Series MCU Data Sheet, Rev. 6
Freescale Semiconductor
11
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
Eqn. 1
where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C/W
PD = Pint + PI/O
Pint = IDD × VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ
(if PI/O is neglected) is:
PD = K ÷ (TJ + 273°C)
Eqn. 2
Solving Equation 1 and Equation 2 for K gives:
K = PD × (TA + 273°C) + θJA × (PD)
2
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by
solving Equation 1 and Equation 2 iteratively for any value of TA.
Table 4. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range
(packaged)
TA
TL to TH
–40 to 85
°C
Maximum junction temperature
TJM
95
°C
Thermal resistance
Single-layer board
48-pin QFN
θ
JA
81
°C/W
44-pin LQFP
68
32-pin LQFP
66
28-pin SOIC
57
Thermal resistance
Four-layer board
48-pin QFN
θ
JA
26
°C/W
44-pin LQFP
46
32-pin LQFP
54
28-pin SOIC
42


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