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MCP73832-5ADI/MC bảng dữ liệu(PDF) 5 Page - Microchip Technology

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© 2008 Microchip Technology Inc.
DS21984E-page 5
MCP73831/2
TEMPERATURE SPECIFICATIONS
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for V
DD = [VREG (typical) + 0.3V] to 12V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (typical) + 1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
UVLO Start Delay
tSTART
——
5
ms
VDD Low-to-High
Constant-Current Regulation
Transition Time Out of
Preconditioning
tDELAY
——
1
ms
VBAT < VPTH to VBAT > VPTH
Current Rise Time Out of
Preconditioning
tRISE
——
1
ms
IOUT Rising to 90% of IREG
Termination Comparator
Filter
tTERM
0.4
1.3
3.2
ms
Average IOUT Falling
Charge Comparator Filter
tCHARGE
0.4
1.3
3.2
ms
Average VBAT
Status Indicator
Status Output turn-off
tOFF
——
200
µ
sISINK = 1 mA to 0 mA
Status Output turn-on
tON
——
200
µ
sISINK = 0 mA to 1 mA
Electrical Specifications: Unless otherwise indicated, all limits apply for V
DD = [VREG (typical) + 0.3V] to 12V.
Typical values are at +25°C, VDD = [VREG (typical) + 1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Temperature Ranges
Specified Temperature Range
TA
-40
+85
°C
Operating Temperature Range
TJ
-40
+125
°C
Storage Temperature Range
TA
-65
+150
°C
Thermal Package Resistances
5-Lead, SOT-23
θ
JA
230
°C/W
4-Layer JC51-7 Standard
Board, Natural Convection
(Note 2)
8-Lead, 2 mm x 3 mm, DFN
θ
JA
76
°C/W
4-Layer JC51-7 Standard
Board, Natural Convection
(Note 1)
Note 1: This represents the minimum copper condition on the PCB (Printed Circuit Board).
2: With large copper area on the PCB, the SOT-23-5 thermal resistance (
θ
JA ) can reach a typical value of
130°C/W or better.


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