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ADCLK948BCPZ bảng dữ liệu(PDF) 5 Page - Analog Devices |
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5 / 12 page ADCLK948 Rev. 0 | Page 5 of 12 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Rating Supply Voltage VCC − VEE 6 V Input Voltage CLK0, CLK1, CLK0, CLK1, IN_SEL VEE − 0.5 V to VCC + 0.5 V CLK0, CLK1, CLK0, CLK1 to VTx Pin (CML, LVPECL Termination) ±40 mA CLK0, CLK1 to CLK0, CLK1 ±1.8 V Input Termination, VTx to CLK0, CLK1, CLK0, and CLK1 ±2 V Maximum Voltage on Output Pins VCC + 0.5 V Maximum Output Current 35 mA Voltage Reference (VREFx) VCC to VEE Operating Temperature Range Ambient −40°C to +85°C Junction 150°C Storage Temperature Range −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DETERMINING JUNCTION TEMPERATURE To determine the junction temperature on the application printed circuit board (PCB), use the following equation: TJ = TCASE + (ΨJT × PD) where: TJ is the junction temperature (°C). TCASE is the case temperature (°C) measured by the customer at the top center of the package. Ψ JT is from Table 6. PD is the power dissipation. Values of θJA are provided for package comparison and PCB design considerations. θJA can be used for a first-order approxi- mation of TJ by the equation TJ = TA + (θJA × PD) where TA is the ambient temperature (°C). Values of θJB are provided in Table 6 for package comparison and PCB design considerations. ESD CAUTION THERMAL PERFORMANCE Table 6. Parameter Symbol Description Value1 Unit Junction-to-Ambient Thermal Resistance θ JA Still Air Per JEDEC JESD51-2 0 m/sec Air Flow 49.8 °C/W Moving Air θ JMA Per JEDEC JESD51-6 1 m/sec Air Flow 43.5 °C/W 2.5 m/sec Air Flow 39.0 °C/W Junction-to-Board Thermal Resistance θ JB Moving Air Per JEDEC JESD51-8 1 m/sec Air Flow 30.7 °C/W Junction-to-Case Thermal Resistance θ JC Moving Air Per MIL-STD 883, Method 1012.1 Die-to-Heatsink 8.8 °C/W Junction-to-Top-of-Package Characterization Parameter Ψ JT Still Air Per JEDEC JESD51-2 0 m/sec Air Flow 0.7 °C/W 1 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the application to determine if they are similar to those assumed in these calculations. |
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