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ADCLK846BCPZ-REEL7 bảng dữ liệu(PDF) 6 Page - Analog Devices |
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6 / 16 page ADCLK846 Rev. A | Page 6 of 16 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Rating Supply Voltage VS to GND 2 V Inputs CLK and CLK −0.3 V to +2 V CMOS Inputs −0.3 V to +2 V Outputs Maximum Voltage −0.3 V to +2 V Voltage Reference Voltage (VREF) −0.3 V to +2 V Operating Temperature Range Ambient −40°C to +85°C Junction 150°C Storage Temperature Range −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DETERMINING JUNCTION TEMPERATURE To determine the junction temperature on the application PCB, use the following formula: TJ = TCASE + (ΨJT × PD) where: TJ is the junction temperature (°C). TCASE is the case temperature (°C) measured by the customer at top center of the package. ΨJT is indicated in Table 6. PD is the power dissipation. Values of θJA are provided for package comparison and PCB design considerations. θJA can be used for a first-order approximation of TJ by the equation TJ = TA + (θJA × PD) where TA is the ambient temperature (°C). Values of θJB are provided for package comparison and PCB design considerations. ESD CAUTION THERMAL PERFORMANCE Table 6. Parameter Symbol Description Value1 Unit Junction-to-Ambient Thermal Resistance θ JA Still Air Per JEDEC JESD51-2 0.0 m/sec Airflow 57.0 °C/W Moving Air θ JMA Per JEDEC JESD51-6 1.0 m/sec Airflow 49.8 °C/W 2.5 m/sec Airflow 44.7 °C/W Junction-to-Board Thermal Resistance θ JB Moving Air Per JEDEC JESD51-8 1.0 m/sec Airflow 35.2 °C/W Junction-to-Case Thermal Resistance θ JC Moving Air Per MIL-STD 883, Method 1012.1 Die-to-Heat Sink 2.0 °C/W Junction-to-Top-of-Package Characterization Parameter ΨJT Still Air Per JEDEC JESD51-2 0 m/sec Airflow 1.0 °C/W 1 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the application to determine if they are similar to those assumed in these calculations. |
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