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ADP8860ACPZ-R7 bảng dữ liệu(PDF) 6 Page - Analog Devices |
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ADP8860ACPZ-R7 bảng dữ liệu(HTML) 6 Page - Analog Devices |
6 / 52 page ADP8860 Rev. 0 | Page 6 of 52 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating VIN, VOUT −0.3 V to +6 V D1, D2, D3, D4, D5, D6, and D7 −0.3 V to +6 V CMP_IN −0.3 V to +6 V nINT, nRST, SCL, and SDA −0.3 V to +6 V Output Short-Circuit Duration Indefinite Operating Ambient Temperature Range –40°C to +85°C1 Operating Junction Temperature Range –40°C to +125°C Storage Temperature Range –65°C to +150°C Soldering Conditions JEDEC J-STD-020 ESD (Electrostatic Discharge) Human Body Model (HBM) ±2 kV Charged Device Model (CDM) ±2 kV θJA (junction to air) is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. The θJA, θJB (junction to board), and θJC (junction to case) are determined according to JESD51-9 on a 4-layer printed circuit board (PCB) with natural convection cooling. For the LFCSP package, the exposed pad must be soldered to the GND1 and/or GND2 terminal(s) on the board. Table 3. Thermal Resistance1 Package Type θJA θJB θJC Unit WLCSP 48 9 N/A °C/W LFCSP_VQ 49.5 N/A 5.3 °C/W 1 N/A means not applicable. 1 The maximum operating junction temperature (TJ(MAX)) supersedes the maximum operating ambient temperature (TA(MAX)). See the Maximum Temperature Ranges section for more information. ESD CAUTION Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all voltages are referenced to GND. MAXIMUM TEMPERATURE RANGES The maximum operating junction temperature (TJ(MAX)) supersedes the maximum operating ambient temperature (TA(MAX)). Therefore, in situations where the ADP8860 is exposed to poor thermal resistance and a high power dissipation (PD), the maximum ambient temperature may need to be derated. In these cases, the ambient temperature maximum can be calculated with the following equation: TA(MAX) = TJ(MAX) − (θJA × PD(MAX)) |
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