TL2218-285, TL2218-285Y

EXCALIBUR CURRENT-MODE SCSI TERMINATOR

SLVS072C – DECEMBER 1992 – REVISED OCTOBER 1995

POST OFFICE BOX 655303

8–6

THERMAL INFORMATION

The need for smaller surface-mount packages for use on compact printed-wiring boards (PWB) causes an

increasingly difficult problem in the area of thermal dissipation. In order to provide the systems designer with a better

approximation of the junction temperature rise in the thin-shrink small-outline package (TSSOP), the junction-to-lead

of the device. The board temperature is contingent upon several variables, including device packing density,

to the die-mount pad, the lead-frame alloy, area of the die, mount material, and mold compound. Since the power level

at which the TSSOP can be used is highly dependent upon both the temperature rise of the PWB and the device itself,

the systems designer can maximize this level by optimizing the circuit board. The junction temperature of the device

The values of thermal resistance for the TL2218-285 PW are as follows:

Thermal Resistance

Typical Junction Rise

151

°C/W

31

°C/W

50.5

°C/W

TYPICAL CHARACTERISTICS

Table of Graphs

FIGURE

IO

Output current

vs Input voltage

4

VO

Output voltage

vs Input voltage

5

IO

Output current

vs Junction temperature

6

VO

Output voltage

vs Junction temperature

7