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U1AFS1500-FG256 bảng dữ liệu(PDF) 7 Page - Actel Corporation

tên linh kiện U1AFS1500-FG256
Giải thích chi tiết về linh kiện  3 - DC and Power Characteristics
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nhà sản xuất  ACTEL [Actel Corporation]
Trang chủ  http://www.actel.com
Logo ACTEL - Actel Corporation

U1AFS1500-FG256 bảng dữ liệu(HTML) 7 Page - Actel Corporation

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Actel Fusion Mixed-Signal FPGA for the MicroBlade AdvancedMC Solution
Pr el iminar y v0 .4
3-7
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not
the ambient, case, or board temperatures. This is an important distinction because dynamic and
static power consumption will cause the chip's junction temperature to be higher than the
ambient, case, or board temperatures. EQ 3-1 through EQ 3-3 give the relationship between
thermal resistance, temperature gradient, and power.
EQ 3-1
EQ 3-2
EQ 3-3
where
θ
JA
= Junction-to-air thermal resistance
θ
JB
= Junction-to-board thermal resistance
θ
JC
= Junction-to-case thermal resistance
TJ
= Junction temperature
TA
= Ambient temperature
TB
= Board temperature (measured 1.0 mm away from
the package edge)
TC
= Case temperature
P
= Total power dissipated by the device
θ
JA
T
J
θ
A
P
-----------------
=
θ
JB
T
J
T
B
P
----------------
=
θ
JC
T
J
T
C
P
-----------------
=
Table 3-6 •
Package Thermal Resistance
Product
θ
JA
θ
JC
θ
JB
Units
Still Air
1.0 m/s
2.5 m/s
U1AFS250-FG256
33.7
30.0
28.3
9.3
24.8
°C/W
U1AFS600-FG256
28.9
25.2
23.5
6.8
19.9
°C/W
U1AFS1500-FG256
23.3
19.6
18.0
4.3
14.2
°C/W


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