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SMDA24C bảng dữ liệu(PDF) 5 Page - Semtech Corporation |
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SMDA24C bảng dữ liệu(HTML) 5 Page - Semtech Corporation |
5 / 7 page 5 2005 Semtech Corp. www.semtech.com PROTECTION PRODUCTS PROTECTION PRODUCTS SMDA05C THRU SMDA24C Circuit Diagram I/O Line Protection Device Connection for Protection of Four Data Lines The SMDAxxC series of devices are designed to protect up to four data lines. The devices are connected as follows: The SMDAxxC are bidirectional devices and are designed for use on lines where the normal operat- ing voltage is above and below ground. Pins 1, 2, 3, and 4 are connected to the protected lines. Pins 5, 6, 7, and 8 are connected to ground. Since the device is electrically symmetrical, these connec- tions may be reversed. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic induc- tance in the board traces. Circuit Board Layout Recommendations for Suppres- sion of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connec- tors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 1 2 3 45 6 7 8 Ground From Connector To Protected Device Typical Connection 1 2 3 45 6 7 8 Applications Information |
Số phần tương tự - SMDA24C |
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Mô tả tương tự - SMDA24C |
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