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TDA1170S bảng dữ liệu(PDF) 8 Page - STMicroelectronics

tên linh kiện TDA1170S
Giải thích chi tiết về linh kiện  TV VERTICAL DEFLECTION
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
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TDA1170S bảng dữ liệu(HTML) 8 Page - STMicroelectronics

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MOUNTING INSTRUCTION
The junction to ambient thermal resistance of the
TDA 1170S can be reduced by soldering the tabs
to a suitable copper area of the printed circuit board
(fig. 4) or to an external heatsink (fig. 5).
The diagram of fig. 6 shows the maximum dissipa-
ble power Ptot and the Rth j-amb as a function of the
side ”s” of two equal square copper areas having
a thickness of 35
µ (1.4 mil).
Figure 4 :
Example of P.C Board Copper Are
is Used as Heatsink
Figure 5 :
Example with External Heatsink
Figure 6 :
Maximum Power Dissipation and
Junction-Ambient Thermal
Resistance versus ”S”
Figure 7 :
Maximum Allowable Power
Dissipation versus Ambient
Temperature
TDA1170S
8/9


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