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MC33880DWBR2 bảng dữ liệu(PDF) 5 Page - Freescale Semiconductor, Inc |
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MC33880DWBR2 bảng dữ liệu(HTML) 5 Page - Freescale Semiconductor, Inc |
5 / 25 page Analog Integrated Circuit Device Data Freescale Semiconductor 5 33880 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 3. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit VDD Supply Voltage (1) VDD -0.3 to 7.0 VDC CS, DI, DO, SCLK, IN5, IN6, and EN (1) – -0.3 to 7.0 VDC VPWR Supply Voltage (1) VPWR -16 to 50 VDC Drain 1–8 (2) 5.0 mA ≤ IOUT ≤ 0.3 A – -18 to 40 VDC Source 1–8 (3) 5.0 mA ≤ IOUT ≤ 0.3 A – -28 to 40 VDC Output Voltage Clamp Low-Side Drive (4) VOC 40 to 55 VDC Output Voltage Clamp High-Side Drive (4) VOC -15 to -25 VDC Output Clamp Energy (5) ECLAMP 50 mJ ESD Voltage (6) Human Body Model Machine Model VESD1 VESD2 ±2000 ±200 V Storage Temperature TSTG -55 to 150 °C Operating Case Temperature TC -40 to 125 °C Operating Junction Temperature TJ -40 to 150 °C Maximum Junction Temperature – -40 to 150 °C Power Dissipation (TA = 25°C) (7) 28 SOIC, Case 751F-05 32 SOIC, Case 1324-02 PD 1.3 1.7 W Thermal Resistance, Junction-to-Ambient, 28 SOIC, Case 751F-05 RθJA 94 °C/W Thermal Resistance, Junction-to-Ambient, 32 SOIC, Case 1324-02 Thermal Resistance, Junction-to-Thermal Ground Leads, 32 SOIC, Case 1324-02 RθJA RθJL 70 18 °C/W Peak Package Reflow Temperature During Reflow (5), (6) TPPRT Note 6 °C Notes 1. Exceeding these limits may cause malfunction or permanent damage to the device. 2. Configured as low-side driver with 300 mA load as current limit. 3. Configured as high-side driver with 300 mA load as current limit. 4. With outputs OFF and 10 mA of test current for low-side driver, 30 mA test current for high-side driver. 5. Maximum output clamp energy capability at 150 °C junction temperature using single non-repetitive pulse method. 6. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), and ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). 7. Maximum power dissipation with no heatsink used. |
Số phần tương tự - MC33880DWBR2 |
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Mô tả tương tự - MC33880DWBR2 |
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