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MC33880DWBR2 bảng dữ liệu(PDF) 5 Page - Freescale Semiconductor, Inc

tên linh kiện MC33880DWBR2
Giải thích chi tiết về linh kiện  Configurable Octal Serial Switch with Serial Peripheral Interface I/O
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nhà sản xuất  FREESCALE [Freescale Semiconductor, Inc]
Trang chủ  http://www.freescale.com
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MC33880DWBR2 bảng dữ liệu(HTML) 5 Page - Freescale Semiconductor, Inc

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Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33880
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
VDD Supply Voltage (1)
VDD
-0.3 to 7.0
VDC
CS, DI, DO, SCLK, IN5, IN6, and EN (1)
-0.3 to 7.0
VDC
VPWR Supply Voltage (1)
VPWR
-16 to 50
VDC
Drain 1–8 (2)
5.0 mA
≤ IOUT ≤ 0.3 A
-18 to 40
VDC
Source 1–8 (3)
5.0 mA
≤ IOUT ≤ 0.3 A
-28 to 40
VDC
Output Voltage Clamp Low-Side Drive (4)
VOC
40 to 55
VDC
Output Voltage Clamp High-Side Drive (4)
VOC
-15 to -25
VDC
Output Clamp Energy (5)
ECLAMP
50
mJ
ESD Voltage (6)
Human Body Model
Machine Model
VESD1
VESD2
±2000
±200
V
Storage Temperature
TSTG
-55 to 150
°C
Operating Case Temperature
TC
-40 to 125
°C
Operating Junction Temperature
TJ
-40 to 150
°C
Maximum Junction Temperature
-40 to 150
°C
Power Dissipation (TA = 25°C) (7)
28 SOIC, Case 751F-05
32 SOIC, Case 1324-02
PD
1.3
1.7
W
Thermal Resistance, Junction-to-Ambient, 28 SOIC, Case 751F-05
RθJA
94
°C/W
Thermal Resistance, Junction-to-Ambient, 32 SOIC, Case 1324-02
Thermal Resistance, Junction-to-Thermal Ground Leads, 32 SOIC, Case 1324-02
RθJA
RθJL
70
18
°C/W
Peak Package Reflow Temperature During Reflow (5), (6)
TPPRT
Note 6
°C
Notes
1.
Exceeding these limits may cause malfunction or permanent damage to the device.
2.
Configured as low-side driver with 300 mA load as current limit.
3.
Configured as high-side driver with 300 mA load as current limit.
4.
With outputs OFF and 10 mA of test current for low-side driver, 30 mA test current for high-side driver.
5.
Maximum output clamp energy capability at 150
°C junction temperature using single non-repetitive pulse method.
6.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), and ESD2 testing is performed
in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
7.
Maximum power dissipation with no heatsink used.


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